×

Chemical content PESD5V0U1UL

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD5V0U1ULSOD882DFN1006-20.92531 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340621843151112601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.82135
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11315
Phenolic resinProprietary0.0013513.530000.14622
subTotal0.01000100.000001.08072
DieDoped siliconSilicon (Si)7440-21-30.03000100.000003.24216
subTotal0.03000100.000003.24216
Lead FrameCopper alloyCopper (Cu)7440-50-80.3874194.4900041.86802
Magnesium (Mg)7439-95-40.000820.200000.08862
Nickel (Ni)7440-02-00.012923.150001.39575
Silicon (Si)7440-21-30.002830.690000.30574
Pure metal layerGold (Au)7440-57-50.000120.030000.01329
Nickel (Ni)7440-02-00.005211.270000.56273
Palladium (Pd)7440-05-30.000700.170000.07533
subTotal0.41000100.0000044.30948
Mould CompoundFillerSilica -amorphous-7631-86-90.1035023.0000011.18544
Silica fused60676-86-00.2700060.0000029.17941
Flame retardantMetal hydroxideProprietary0.013503.000001.45897
ImpurityBismuth (Bi)7440-69-90.002250.500000.24316
PigmentCarbon black1333-86-40.002250.500000.24316
PolymerEpoxy resin systemProprietary0.031507.000003.40426
Phenolic resinProprietary0.027006.000002.91794
subTotal0.45000100.0000048.63234
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00120
Tin solderTin (Sn)7440-31-50.0199999.940002.16014
subTotal0.02000100.000002.16144
WireImpurityNon hazardousProprietary0.000000.010000.00006
Pure metalGold (Au)7440-57-50.0053199.990000.57414
subTotal0.00531100.000000.57420
total0.92531100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.