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Chemical content PESD5V0U2BMB

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Type numberPackagePackage descriptionTotal product weight
PESD5V0U2BMBSOT883BXQFN30.67934 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065859315712601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.33562
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04624
Phenolic resinProprietary0.0004113.530000.05975
subTotal0.00300100.000000.44161
DieDoped siliconSilicon (Si)7440-21-30.03000100.000004.41605
subTotal0.03000100.000004.41605
Lead FrameCopper alloyChromium (Cr)7440-47-30.000670.240000.09892
Copper (Cu)7440-50-80.2632094.0000038.74349
Tin (Sn)7440-31-50.000670.240000.09892
Zinc (Zn)7440-66-60.000590.210000.08655
Pure metal layerGold (Au)7440-57-50.000220.080000.03297
Nickel (Ni)7440-02-00.013834.940002.03609
Palladium (Pd)7440-05-30.000810.290000.11953
subTotal0.28000100.0000041.21647
Mould CompoundFillerSilica -amorphous-7631-86-90.0782023.0000011.51117
Silica fused60676-86-00.2040060.0000030.02915
Flame retardantMetal hydroxideProprietary0.010203.000001.50146
ImpurityBismuth (Bi)7440-69-90.001700.500000.25024
PigmentCarbon black1333-86-40.001700.500000.25024
PolymerEpoxy resin systemProprietary0.023807.000003.50340
Phenolic resinProprietary0.020406.000003.00291
subTotal0.34000100.0000050.04857
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00013
Non hazardousProprietary0.000010.055500.00163
Tin solderTin (Sn)7440-31-50.0199999.940002.94227
subTotal0.02000100.000002.94403
WireImpurityNon hazardousProprietary0.000000.010000.00009
Pure metalGold (Au)7440-57-50.0063499.990000.93375
subTotal0.00634100.000000.93384
total0.67934100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.