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Chemical content PESD5V0U4BF

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Type numberPackagePackage descriptionTotal product weight
PESD5V0U4BFdummy POV SOT886XSON61.93912 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340619511151012601235Dongguan, China; D-22529 HAMBURG, Germany; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0380076.000001.95965
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0052410.470000.26997
Phenolic resinProprietary0.0067613.530000.34887
subTotal0.05000100.000002.57849
DieDoped siliconSilicon (Si)7440-21-30.05000100.000002.57849
subTotal0.05000100.000002.57849
Lead FrameCopper alloyCopper (Cu)7440-50-80.7244391.7000037.35870
Magnesium (Mg)7439-95-40.001340.170000.06926
Nickel (Ni)7440-02-00.024173.060001.24665
Silicon (Si)7440-21-30.005450.690000.28111
Pure metal layerGold (Au)7440-57-50.000470.060000.02444
Nickel (Ni)7440-02-00.031203.950001.60924
Palladium (Pd)7440-05-30.002920.370000.15074
subTotal0.79000100.0000040.74014
Mould CompoundFillerSilica -amorphous-7631-86-90.2300023.0000011.86105
Silica fused60676-86-00.6000060.0000030.94187
Flame retardantMetal hydroxideProprietary0.030003.000001.54709
ImpurityBismuth (Bi)7440-69-90.005000.500000.25785
PigmentCarbon black1333-86-40.005000.500000.25785
PolymerEpoxy resin systemProprietary0.070007.000003.60988
Phenolic resinProprietary0.060006.000003.09419
subTotal1.00000100.0000051.56978
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00005
Bismuth (Bi)7440-69-90.000000.001000.00002
Copper (Cu)7440-50-80.000000.001000.00002
Lead (Pb)7439-92-10.000000.005000.00008
Tin solderTin (Sn)7440-31-50.0300099.990001.54694
subTotal0.03000100.000001.54711
WireImpurityNon hazardousProprietary0.000000.010000.00010
Pure metalGold (Au)7440-57-50.0191299.990000.98592
subTotal0.01912100.000000.98602
total1.93912100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.