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Chemical content PESD5V0V2BMB

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Type numberPackagePackage descriptionTotal product weight
PESD5V0V2BMBSOT883BXQFN30.70364 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934069289315512601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.32403
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04464
Phenolic resinProprietary0.0004113.530000.05769
subTotal0.00300100.000000.42636
DieDoped siliconSilicon (Si)7440-21-30.05000100.000007.10591
subTotal0.05000100.000007.10591
Lead FrameCopper alloyChromium (Cr)7440-47-30.000670.240000.09550
Copper (Cu)7440-50-80.2632094.0000037.40549
Tin (Sn)7440-31-50.000670.240000.09550
Zinc (Zn)7440-66-60.000590.210000.08357
Pure metal layerGold (Au)7440-57-50.000220.080000.03183
Nickel (Ni)7440-02-00.013834.940001.96578
Palladium (Pd)7440-05-30.000810.290000.11540
subTotal0.28000100.0000039.79307
Mould CompoundFillerSilica -amorphous-7631-86-90.0782023.0000011.11364
Silica fused60676-86-00.2040060.0000028.99210
Flame retardantMetal hydroxideProprietary0.010203.000001.44960
ImpurityBismuth (Bi)7440-69-90.001700.500000.24160
PigmentCarbon black1333-86-40.001700.500000.24160
PolymerEpoxy resin systemProprietary0.023807.000003.38241
Phenolic resinProprietary0.020406.000002.89921
subTotal0.34000100.0000048.32016
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00013
Non hazardousProprietary0.000010.055500.00158
Tin solderTin (Sn)7440-31-50.0199999.940002.84066
subTotal0.02000100.000002.84237
WireImpurityNon hazardousProprietary0.000000.010000.00015
Pure metalGold (Au)7440-57-50.0106499.990001.51199
subTotal0.01064100.000001.51214
total0.70364100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.