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Chemical content PESD5V5C1BL-Q

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Type numberPackagePackage descriptionTotal product weight
PESD5V5C1BL-QSOD882-2DFN1006-20.96935 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934665805315412601235Dongguan, China; D-22529 HAMBURG, Germany; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0012060.000000.12379
ImpurityNon hazardousProprietary0.000000.039500.00008
PolymerResin systemProprietary0.0008039.951410.08243
subTotal0.00200100.000000.20630
DieDoped siliconSilicon (Si)7440-21-30.15500100.0000015.99010
subTotal0.15500100.0000015.99010
Lead FrameCopper alloyCopper (Cu)7440-50-80.3492993.6428636.03320
Magnesium (Mg)7439-95-40.000540.146010.05618
Nickel (Ni)7440-02-00.010892.920261.12370
Silicon (Si)7440-21-30.002360.632720.24347
Pure metal layerGold (Au)7440-57-50.000120.032820.01263
Nickel (Ni)7440-02-00.009402.519470.96948
Palladium (Pd)7440-05-30.000390.105860.04073
subTotal0.37300100.0000038.47939
Mould CompoundFillerSilica -amorphous-7631-86-90.034797.980003.58929
Silica fused60676-86-00.3492080.0920036.02426
PigmentCarbon black1333-86-40.004050.928000.41740
PolymerEpoxy resin systemProprietary0.036848.450003.80069
Phenolic resinProprietary0.011122.550001.14695
subTotal0.43600100.0000044.97859
WireGold alloyGold (Au)7440-57-50.0033299.000000.34214
Palladium (Pd)7440-05-30.000031.000000.00346
subTotal0.00335100.000000.34560
total0.96935100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.