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Chemical content PESD5V5C1UL-Q

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Type numberPackagePackage descriptionTotal product weight
PESD5V5C1UL-QSOD882-2DFN1006-20.96990 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934665806315412601235D-22529 HAMBURG, Germany; Dongguan, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0012060.000000.12372
ImpurityNon hazardousProprietary0.000000.039500.00008
PolymerResin systemProprietary0.0008039.951410.08238
subTotal0.00200100.000000.20618
DieDoped siliconSilicon (Si)7440-21-30.15500100.0000015.98103
subTotal0.15500100.0000015.98103
Lead FrameCopper alloyCopper (Cu)7440-50-80.3492993.6428636.01277
Magnesium (Mg)7439-95-40.000540.146010.05615
Nickel (Ni)7440-02-00.010892.920261.12306
Silicon (Si)7440-21-30.002360.632720.24333
Pure metal layerGold (Au)7440-57-50.000120.032820.01262
Nickel (Ni)7440-02-00.009402.519470.96893
Palladium (Pd)7440-05-30.000390.105860.04071
subTotal0.37300100.0000038.45757
Mould CompoundAdditiveNon hazardousProprietary0.001790.410000.18431
FillerSilica -amorphous-7631-86-90.001260.290000.13036
Silica fused60676-86-00.3756186.1500038.72709
HardenerPhenolic resinProprietary0.018704.290001.92849
PigmentCarbon black1333-86-40.000830.190000.08541
PolymerEpoxy resin systemProprietary0.037808.670003.89743
subTotal0.43600100.0000044.95309
WireGold alloyGold (Au)7440-57-50.0038699.000000.39808
Palladium (Pd)7440-05-30.000041.000000.00402
subTotal0.00390100.000000.40210
total0.96990100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.