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Chemical content PESD6V3S1UL

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Type numberPackagePackage descriptionTotal product weight
PESD6V3S1ULSOD882DFN1006-20.92932 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662577315212601235D-22529 HAMBURG, Germany; Dongguan, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.81780
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11266
Phenolic resinProprietary0.0013513.530000.14559
subTotal0.01000100.000001.07605
DieDoped siliconSilicon (Si)7440-21-30.03500100.000003.76619
subTotal0.03500100.000003.76619
Lead FrameCopper alloyCopper (Cu)7440-50-80.3874194.4900041.68736
Magnesium (Mg)7439-95-40.000820.200000.08824
Nickel (Ni)7440-02-00.012923.150001.38973
Silicon (Si)7440-21-30.002830.690000.30442
Pure metal layerGold (Au)7440-57-50.000120.030000.01324
Nickel (Ni)7440-02-00.005211.270000.56030
Palladium (Pd)7440-05-30.000700.170000.07500
subTotal0.41000100.0000044.11829
Mould CompoundFillerSilica -amorphous-7631-86-90.1035023.0000011.13718
Silica fused60676-86-00.2700060.0000029.05350
Flame retardantMetal hydroxideProprietary0.013503.000001.45268
ImpurityBismuth (Bi)7440-69-90.002250.500000.24211
PigmentCarbon black1333-86-40.002250.500000.24211
PolymerEpoxy resin systemProprietary0.031507.000003.38958
Phenolic resinProprietary0.027006.000002.90535
subTotal0.45000100.0000048.42251
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00119
Tin solderTin (Sn)7440-31-50.0199999.940002.15082
subTotal0.02000100.000002.15211
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0043299.990000.46481
subTotal0.00432100.000000.46486
total0.92932100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.