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Chemical content PHDMI2AB4

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Type numberPackagePackage descriptionTotal product weight
PHDMI2AB4SOT1176-1XSON103.06900 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660001471612601235Bangkok, Thailand; Dongguan, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveActive agent2-Phenyl-4,5-bis(hydroxymethyl)imidazole61698-32-60.002505.000000.08146
FillerSilica -amorphous-7631-86-90.0300060.000000.97752
PolymerBisphenol A-epichlorohydrin resin25068-38-60.0100020.000000.32584
Phenol, polymer with 3a,4,7,7a-tetrahydro-4,7-methano-1H-indene, glycidyl ether119345-05-00.0075015.000000.24438
subTotal0.05000100.000001.62920
DieDoped siliconSilicon (Si)7440-21-30.06400100.000002.08537
subTotal0.06400100.000002.08537
Lead FrameCopper alloyCopper (Cu)7440-50-80.8986094.5900029.28006
Magnesium (Mg)7439-95-40.001620.170000.05262
Nickel (Ni)7440-02-00.041044.320001.33724
Silicon (Si)7440-21-30.006740.710000.21978
Pure metal layerGold (Au)7440-57-50.000280.030000.00929
Nickel (Ni)7440-02-00.001040.110000.03405
Palladium (Pd)7440-05-30.000480.050000.01548
Silver (Ag)7440-22-40.000190.020000.00619
subTotal0.95000100.0000030.95471
Mould CompoundFillerSilica -amorphous-7631-86-90.140007.000004.56175
Silica fused60676-86-01.6600083.0000054.08928
PigmentCarbon black1333-86-40.010000.500000.32584
PolymerEpoxy resin systemProprietary0.120006.000003.91007
Phenolic resinProprietary0.070003.500002.28087
subTotal2.00000100.0000065.16781
WirePure metalGold (Au)7440-57-50.0049599.000000.16129
Palladium (Pd)7440-05-30.000051.000000.00163
subTotal0.00500100.000000.16292
total3.06900100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.