| 12NC | OPN | Type No. | Package | State | MSL |
|---|---|---|---|---|---|
| 934055804127 | PHP45NQ10T,127 | PHP45NQ10T | SOT78 (SIL3P) | DOD | None |
| REACH | Compliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 7439-92-1 at 3346 ppm of the article. SCIP No. 82335932-ef67-43ae-bc5d-5f47a3b97aa5. |
| EU RoHS | Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'. |
| CN RoHS | Compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS); using exemption 8.1: '高熔点焊料 (如铅含量超过85%（重量百分比）的铅基合金焊料）'. |
| ELV | Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'. |
| PFAS | Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS). |
| CA Proposition 65 | Contains California Proposition 65 substance(s) [at the article level]: substance 1333-86-4: 1417 ppm; substance 7439-92-1: 3346 ppm; substance 7440-02-0: 7215 ppm; |
| IEC 62474 | Contains IEC 62474 substance(s) [at the article level]: substance 1333-86-4: 1417 ppm; substance 7439-92-1: 3346 ppm; substance 7440-02-0: 7215 ppm; |
| Precious Metals | Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 54 ppm; |
| RHF Indicator | Contains EU/CN RoHS-exempted lead and is halogen-free according to Nexperia's halogen-free definition.   |
| Material | Material Group | Substance | CAS No. | Mass (mg) | Material (%) | Product (%) |
|---|---|---|---|---|---|---|
| Die | Doped silicon | Silicon (Si) | 7440-21-3 | 7.400000 | 100.000000 | 0.376723 |
| Die Total | 7.400000 | 100.000000 | 0.376723 | |||
| Lead Frame | Copper alloy | Copper (Cu) | 7440-50-8 | 1318.301720 | 98.600000 | 67.112734 |
| Lead Frame | Copper alloy | Nickel (Ni) | 7440-02-0 | 14.172412 | 1.060000 | 0.721496 |
| Lead Frame | Copper alloy | Phosphorus (P) | 7723-14-0 | 3.208848 | 0.240000 | 0.163357 |
| Lead Frame | Copper alloy | Iron (Fe) | 7439-89-6 | 1.337020 | 0.100000 | 0.068066 |
| Lead Frame Total | 1337.020000 | 100.000000 | 68.065653 | |||
| Mould Compound | Filler | Silica fused | 60676-86-0 | 345.296600 | 62.000000 | 17.578525 |
| Mould Compound | Flame retardant | Aluminium hydroxide (Al(OH)3) | 21645-51-2 | 83.539500 | 15.000000 | 4.252869 |
| Mould Compound | Polymer | Epoxy resin system | 83.539500 | 15.000000 | 4.252869 | |
| Mould Compound | Polymer | Phenolic resin | 38.985100 | 7.000000 | 1.984672 | |
| Mould Compound | Pigment | Carbon black | 1333-86-4 | 2.784650 | 0.500000 | 0.141762 |
| Mould Compound | Additive | Non-declarable | 2.784650 | 0.500000 | 0.141762 | |
| Mould Compound Total | 556.930000 | 100.000000 | 28.352459 | |||
| Post-Plating | Tin alloy | Tin (Sn) | 7440-31-5 | 47.505249 | 99.990000 | 2.418420 |
| Post-Plating | Impurity | Non-declarable | 0.004751 | 0.010000 | 0.000242 | |
| Post-Plating Total | 47.510000 | 100.000000 | 2.418662 | |||
| Wire 1 | Pure metal | Aluminium (Al) | 7429-90-5 | 8.163417 | 99.990000 | 0.415587 |
| Wire 1 | Dopant | Nickel (Ni) | 7440-02-0 | 0.000816 | 0.010000 | 0.000042 |
| Wire 1 Total | 8.164233 | 100.000000 | 0.415629 | |||
| Wire 2 | Pure metal | Aluminium (Al) | 7429-90-5 | 0.255106 | 99.990000 | 0.012987 |
| Wire 2 | Impurity | Non-declarable | 0.000026 | 0.010000 | 0.000001 | |
| Wire 2 Total | 0.255132 | 100.000000 | 0.012988 | |||
| Solder Wire | Lead alloy | Lead (Pb) | 7439-92-1 | 6.573050 | 93.500000 | 0.334624 |
| Solder Wire | Lead alloy | Tin (Sn) | 7440-31-5 | 0.351500 | 5.000000 | 0.017894 |
| Solder Wire | Lead alloy | Silver (Ag) | 7440-22-4 | 0.105450 | 1.500000 | 0.005368 |
| Solder Wire Total | 7.030000 | 100.000000 | 0.357886 | |||
| PHP45NQ10T Total | 1964.309365 | 100.000000 |
| Notes |
|---|
| Report created on 2026-01-19 19:12:36 CET+0100 |
| Disclaimer |
|---|
| All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights. |
| 部件名称 Component |
有毒有害物质或元素 (Toxic and hazardous substances or elements) | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Pb (铅) 铅 Lead | Hg (汞) 汞 Mercury | Cd (镉) 镉 Cadmium | Cr6+ (六价铬) 六价铬 Chromium VI |
PBB (多溴联苯)
多溴联苯 Polybrominated biphenyls |
PBDE (多溴二苯醚)
多溴二苯醚 Polybrominated diphenyl ethers |
DEHP (邻苯二甲酸二(2-乙基己)酯)
邻苯二甲酸二(2-乙基己)酯 Di(2-ethylhexyl) phthalate |
BBP (邻苯二甲酸丁苄酯)
邻苯二甲酸丁苄酯 Butyl benzyl phthalate |
DBP (邻苯二甲酸二丁酯)
邻苯二甲酸二丁酯 Dibutyl phthalate |
DIBP (邻苯二甲酸二异丁酯)
邻苯二甲酸二异丁酯 Diisobutyl phthalate |
|
| 半导体芯片 (Die) | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ |
| 引线框架 (Lead Frame) | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ |
| 模封料 (Mould Compound) | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ |
| 后镀层 (Post-Plating) | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ |
| 导线 (Wire) | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ |
| 导线 (Wire) | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ |
| 焊锡丝 (Solder Wire) | ✕ | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ |
| ◯ | 表示该有害物质在该部件的所有均质材料中的含量均符合 GB/T 26572 规定的限量要求。 Indicates that the content of the hazardous substance in all homogeneous materials of this part complies with the limit requirements of GB/T 26572. |
| ✕ | 表示该有害物质在该部件的至少一种均质材料中的含量超过 GB/T 26572 规定的限量要求（如适用，符合相关豁免要求）。 Indicates that the content of the hazardous substance in at least one homogeneous material of this part exceeds the limit requirements of GB/T 26572 (where applicable, in accordance with relevant exemptions). |
|
该半导体产品的环境保护使用期限（EFUP）为50年。 This semiconductor product has an Environmental Friendly Use Period (EFUP) of 50 years. 注：EFUP 的确定基于产品在正常使用条件下的环境与可靠性评估。 Note: The EFUP is determined based on environmental and reliability assessments under normal operating conditions. |
| Notes |
|---|
| Report created on 2026-01-19 19:12:36 CET+0100 |
| Disclaimer |
|---|
| All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights. |