Chemical content PIMC31-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PIMC31-QSOT457SC-7411.21217 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9346642311351126030 s123520 s3Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany 
9346642311151126030 s123520 s3Dongguan, China; D-22529 HAMBURG, Germany; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.21000100.000001.87296
DieDoped siliconSilicon (Si)7440-21-30.21000100.000001.87296
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.003190.080000.02847
Carbon (C)7440-44-00.001600.040000.01423
Chromium (Cr)7440-47-30.008380.210000.07473
Cobalt (Co)7440-48-40.016760.420000.14946
Iron (Fe)7439-89-61.8840847.2200016.80387
Manganese (Mn)7439-96-50.033920.850000.30248
Nickel (Ni)7440-02-01.4192435.5700012.65806
Phosphorus (P)7723-14-00.000800.020000.00712
Silicon (Si)7440-21-30.009980.250000.08897
Sulphur (S)7704-34-90.000800.020000.00712
Pure metal layerCopper (Cu)7440-50-80.5210913.060004.64757
Silver (Ag)7440-22-40.090172.260000.80425
Mould CompoundFillerSilica fused60676-86-04.4412071.0000039.61056
PigmentCarbon black1333-86-40.018770.300000.16737
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2322819.7000010.99054
Phenolic resinProprietary0.562979.000005.02106
Post-PlatingImpurityAntimony (Sb)7440-36-00.000020.003000.00014
Bismuth (Bi)7440-69-90.000010.001000.00005
Copper (Cu)7440-50-80.000010.001000.00005
Lead (Pb)7439-92-10.000030.005000.00023
Tin solderTin (Sn)7440-31-50.5212299.990004.64866
WirePure metalGold (Au)7440-57-50.02569100.000000.22913
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.