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Chemical content PIMC32PA

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Type numberPackagePackage descriptionTotal product weight
PIMC32PASOT1118HUSON67.03972 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934666066115212601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000781.000000.01108
FillerSilver (Ag)7440-22-40.0655284.000000.93072
PolymerBismaleimidodiphenylmethane resin 0.0078010.000000.11080
Isobornyl Methacrylate7534-94-30.003905.000000.05540
subTotal0.07800100.000001.10800
DieDoped siliconSilicon (Si)7440-21-30.09200100.000001.30687
subTotal0.09200100.000001.30687
DieDoped siliconSilicon (Si)7440-21-30.09200100.000001.30687
subTotal0.09200100.000001.30687
Lead FrameCopper alloyCopper (Cu)7440-50-82.5594195.1100036.35670
Magnesium (Mg)7439-95-40.005380.200000.07645
Nickel (Ni)7440-02-00.085303.170001.21176
Silicon (Si)7440-21-30.018570.690000.26376
Pure metal layerGold (Au)7440-57-50.000540.020000.00765
Nickel (Ni)7440-02-00.019910.740000.28287
Palladium (Pd)7440-05-30.001880.070000.02676
subTotal2.69100100.0000038.22595
Mould CompoundFillerSilica -amorphous-7631-86-90.8942423.0000012.70278
Silica fused60676-86-02.3328060.0000033.13768
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.116643.000001.65688
Ion trapping agentBismuth (Bi)7440-69-90.019440.500000.27615
PigmentCarbon black1333-86-40.019440.500000.27615
PolymerEpoxy resin systemProprietary0.272167.000003.86606
Phenolic resinProprietary0.233286.000003.31377
subTotal3.88800100.0000055.22947
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00129
Tin solderTin (Sn)7440-31-50.1639099.940002.32824
subTotal0.16400100.000002.32963
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0347299.990000.49315
subTotal0.03472100.000000.49320
total7.03972100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.