×

Chemical content PIMT1

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PIMT1SOT457SC-7410.87217 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340566621151512601235Melaka, Malaysia; Dongguan, China; D-22529 HAMBURG, Germany; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.08000100.000000.73582
subTotal0.08000100.000000.73582
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.003190.080000.02936
Carbon (C)7440-44-00.001600.040000.01468
Chromium (Cr)7440-47-30.008380.210000.07707
Cobalt (Co)7440-48-40.016760.420000.15414
Iron (Fe)7439-89-61.8840847.2200017.32936
Manganese (Mn)7439-96-50.033920.850000.31194
Nickel (Ni)7440-02-01.4192435.5700013.05391
Phosphorus (P)7723-14-00.000800.020000.00734
Silicon (Si)7440-21-30.009980.250000.09175
Sulphur (S)7704-34-90.000800.020000.00734
Pure metal layerCopper (Cu)7440-50-80.5210913.060004.79292
Silver (Ag)7440-22-40.090172.260000.82940
subTotal3.99000100.0000036.69921
Mould CompoundFillerSilica fused60676-86-04.4412071.0000040.84928
PigmentCarbon black1333-86-40.018770.300000.17260
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2322819.7000011.33424
Phenolic resinProprietary0.562979.000005.17808
subTotal6.25522100.0000057.53420
Post-PlatingImpurityAntimony (Sb)7440-36-00.000020.003000.00014
Bismuth (Bi)7440-69-90.000010.001000.00005
Copper (Cu)7440-50-80.000010.001000.00005
Lead (Pb)7439-92-10.000030.005000.00024
Tin solderTin (Sn)7440-31-50.5212299.990004.79404
subTotal0.52127100.000004.79452
WirePure metalGold (Au)7440-57-50.02569100.000000.23629
subTotal0.02569100.000000.23629
total10.87217100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.