Chemical content PIMZ2

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Type numberPackagePackage descriptionTotal product weight
PIMZ2SOT457SC-7410.95569 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
93405790612514126030 s123520 s3Seremban, Malaysia; D-22529 HAMBURG, Germany; Dongguan, China 
93405790611513126030 s123520 s3Seremban, Malaysia; D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04000100.000000.36511
DieDoped siliconSilicon (Si)7440-21-30.05000100.000000.45638
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.003560.090000.03245
Carbon (C)7440-44-00.001580.040000.01442
Chromium (Cr)7440-47-30.008300.210000.07571
Cobalt (Co)7440-48-40.016590.420000.15143
Iron (Fe)7439-89-61.8683547.3000017.05370
Manganese (Mn)7439-96-50.033580.850000.30646
Nickel (Ni)7440-02-01.4073835.6300012.84616
Phosphorus (P)7723-14-00.000790.020000.00721
Silicon (Si)7440-21-30.010270.260000.09374
Sulphur (S)7704-34-90.000790.020000.00721
Pure metal layerCopper (Cu)7440-50-80.5166613.080004.71591
Silver (Ag)7440-22-40.082162.080000.74993
Mould CompoundFillerSilica fused60676-86-04.5227071.0000041.28174
PigmentCarbon black1333-86-40.019110.300000.17443
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2548919.7000011.45423
Phenolic resinProprietary0.573309.000005.23290
Post-PlatingImpurityAntimony (Sb)7440-36-00.000020.003000.00014
Bismuth (Bi)7440-69-90.000010.001000.00005
Copper (Cu)7440-50-80.000010.001000.00005
Lead (Pb)7439-92-10.000030.005000.00024
Tin solderTin (Sn)7440-31-50.5199599.990004.74592
WirePure metalGold (Au)7440-57-50.02569100.000000.23449
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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