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Chemical content PMBT2907AMB

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Type numberPackagePackage descriptionTotal product weight
PMBT2907AMBSOT883BXQFN30.65502 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660372315212601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0030476.000000.46411
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0004210.470000.06394
Phenolic resinProprietary0.0005413.530000.08262
subTotal0.00400100.000000.61067
DieDoped siliconSilicon (Si)7440-21-30.05000100.000007.63335
subTotal0.05000100.000007.63335
Lead FrameCopper alloyCopper (Cu)7440-50-80.2494291.0300038.07856
Magnesium (Mg)7439-95-40.000470.170000.07111
Nickel (Ni)7440-02-00.007782.840001.18799
Silicon (Si)7440-21-30.001700.620000.25935
Pure metal layerGold (Au)7440-57-50.000220.080000.03346
Nickel (Ni)7440-02-00.013624.970002.07899
Palladium (Pd)7440-05-30.000790.290000.12131
subTotal0.27400100.0000041.83077
Mould CompoundFillerSilica -amorphous-7631-86-90.0685423.0000010.46380
Silica fused60676-86-00.1788060.0000027.29688
Flame retardantMetal hydroxideProprietary0.008943.000001.36484
ImpurityBismuth (Bi)7440-69-90.001490.500000.22747
PigmentCarbon black1333-86-40.001490.500000.22747
PolymerEpoxy resin systemProprietary0.020867.000003.18464
Phenolic resinProprietary0.017886.000002.72969
subTotal0.29800100.0000045.49479
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00015
Non hazardousProprietary0.000010.055500.00186
Tin solderTin (Sn)7440-31-50.0219999.940003.35666
subTotal0.02200100.000003.35867
WireImpurityNon hazardousProprietary0.000000.010000.00011
Pure metalGold (Au)7440-57-50.0070199.990001.07085
subTotal0.00701100.000001.07096
total0.65502100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.