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Chemical content PMBT3904M

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Type numberPackagePackage descriptionTotal product weight
PMBT3904MSOT883XQFN30.86768 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340634753151212601235Dongguan, China; D-22529 HAMBURG, Germany 
934063475303112601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.87590
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.12067
Phenolic resinProprietary0.0013513.530000.15593
subTotal0.01000100.000001.15250
DieDoped siliconSilicon (Si)7440-21-30.03000100.000003.45750
subTotal0.03000100.000003.45750
Lead FrameCopper alloyCopper (Cu)7440-50-80.4016693.4100046.29161
Magnesium (Mg)7439-95-40.000630.146000.07235
Nickel (Ni)7440-02-00.012532.913001.44361
Silicon (Si)7440-21-30.002710.631000.31271
MetallisationGold (Au)7440-57-50.000150.035000.01735
Nickel (Ni)7440-02-00.011852.755001.36531
Palladium (Pd)7440-05-30.000470.110000.05451
subTotal0.43000100.0000049.55745
Mould CompoundFillerSilica -amorphous-7631-86-90.0851023.000009.80776
Silica fused60676-86-00.2220060.0000025.58547
Flame retardantMetal hydroxideProprietary0.011103.000001.27927
ImpurityBismuth (Bi)7440-69-90.001850.500000.21321
PigmentCarbon black1333-86-40.001850.500000.21321
PolymerEpoxy resin systemProprietary0.025907.000002.98497
Phenolic resinProprietary0.022206.000002.55855
subTotal0.37000100.0000042.64244
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00005
Non hazardousProprietary0.000010.055500.00064
Tin solderTin (Sn)7440-31-50.0099999.940001.15181
subTotal0.01000100.000001.15250
WireImpurityNon hazardousProprietary0.000000.010000.00020
Pure metalGold (Au)7440-57-50.0176899.990002.03741
subTotal0.01768100.000002.03761
total0.86768100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.