Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMBT3904YS-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMBT3904YS-QSOT363SC-885.44928 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934664552115212601235Seremban, Malaysia; D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.08000100.000001.46808
subTotal0.08000100.000001.46808
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001860.090000.03419
Carbon (C)7440-44-00.000830.040000.01519
Chromium (Cr)7440-47-30.004350.210000.07977
Cobalt (Co)7440-48-40.008900.430000.16334
Iron (Fe)7439-89-60.9811847.4000018.00568
Manganese (Mn)7439-96-50.017600.850000.32289
Nickel (Ni)7440-02-00.7392035.7100013.56504
Phosphorus (P)7723-14-00.000410.020000.00760
Silicon (Si)7440-21-30.005380.260000.09877
Sulphur (S)7704-34-90.000410.020000.00760
Pure metal layerCopper (Cu)7440-50-80.2713813.110004.98005
Silver (Ag)7440-22-40.038501.860000.70655
subTotal2.07000100.0000037.98667
Mould CompoundFillerSilica fused60676-86-02.1929275.1000040.24238
PigmentCarbon black1333-86-40.008760.300000.16076
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5110017.500009.37739
Phenol Formaldehyde resin (generic)9003-35-40.207327.100003.80454
subTotal2.92000100.0000053.58507
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00020
Bismuth (Bi)7440-69-90.000000.001000.00007
Copper (Cu)7440-50-80.000000.001000.00007
Lead (Pb)7439-92-10.000020.005000.00034
Tin solderTin (Sn)7440-31-50.3699699.990006.78921
subTotal0.37000100.000006.78989
WirePure metalCopper (Cu)7440-50-80.00928100.000000.17021
subTotal0.00928100.000000.17021
total5.44928100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.