Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMBT3906MB

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMBT3906MBSOT883BXQFN30.700198 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065893315512601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00228076.0000000.325622
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00031410.4700000.044859
Phenolic resinProprietary0.00040613.5300000.057969
subTotal0.003000100.0000000.428450
DieDoped siliconSilicon (Si)7440-21-30.050000100.0000007.140837
subTotal0.050000100.0000007.140837
Lead FrameCopper alloyChromium (Cr)7440-47-30.0006720.2400000.095973
Copper (Cu)7440-50-80.26320094.00000037.589368
Tin (Sn)7440-31-50.0006720.2400000.095973
Zinc (Zn)7440-66-60.0005880.2100000.083976
Pure metal layerGold (Au)7440-57-50.0002240.0800000.031991
Nickel (Ni)7440-02-00.0138324.9400001.975441
Palladium (Pd)7440-05-30.0008120.2900000.115967
subTotal0.280000100.00000039.988689
Mould CompoundFillerSilica -amorphous-7631-86-90.07820023.00000011.168270
Silica fused60676-86-00.20400060.00000029.134616
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0102003.0000001.456731
Ion trapping agentBismuth (Bi)7440-69-90.0017000.5000000.242788
PigmentCarbon black1333-86-40.0017000.5000000.242788
PolymerEpoxy resin systemProprietary0.0238007.0000003.399039
Phenolic resinProprietary0.0204006.0000002.913462
subTotal0.340000100.00000048.557694
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000129
Non hazardousProprietary0.0000110.0555000.001585
Tin solderTin (Sn)7440-31-50.01998899.9400002.854621
subTotal0.020000100.0000002.856335
WireImpurityNon hazardousProprietary0.0000010.0100000.000103
Pure metalGold (Au)7440-57-50.00719799.9900001.027892
subTotal0.007198100.0000001.027995
total0.700198100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.