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Chemical content PMBTA64

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Type numberPackagePackage descriptionTotal product weight
PMBTA64SOT23TO-236AB7.80888 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9338164802151412601235D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.21000100.000002.68925
subTotal0.21000100.000002.68925
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002290.090000.02938
Carbon (C)7440-44-00.001020.040000.01306
Chromium (Cr)7440-47-30.005610.220000.07181
Cobalt (Co)7440-48-40.010960.430000.14036
Iron (Fe)7439-89-61.2230147.9800015.66179
Manganese (Mn)7439-96-50.021920.860000.28072
Nickel (Ni)7440-02-00.9212136.1400011.79694
Phosphorus (P)7723-14-00.000510.020000.00653
Silicon (Si)7440-21-30.006630.260000.08487
Sulphur (S)7704-34-90.000510.020000.00653
Pure metal layerCopper (Cu)7440-50-80.2898211.370003.71143
Silver (Ag)7440-22-40.065512.570000.83891
subTotal2.54900100.0000032.64233
Mould CompoundFillerSilica fused60676-86-03.4449271.0000044.11542
PigmentCarbon black1333-86-40.014560.300000.18640
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.9558419.7000012.24047
Phenolic resinProprietary0.436689.000005.59210
subTotal4.85200100.0000062.13439
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000100.055500.00131
Tin solderTin (Sn)7440-31-50.1848999.940002.36768
subTotal0.18500100.000002.36910
WirePure metalGold (Au)7440-57-50.01288100.000000.16494
subTotal0.01288100.000000.16494
total7.80888100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.