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Chemical content PMCPB5530X

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMCPB5530Xdummy POV SOT1118HUSON67.29942 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934066582115412601235Kwai Chung, Hong Kong; Bangkok, Thailand; Nantong, China; Kuching Sarawak, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000781.000000.01069
FillerSilver (Ag)7440-22-40.0655284.000000.89761
PolymerBismaleimidodiphenylmethane resin 0.0078010.000000.10686
Isobornyl Methacrylate7534-94-30.003905.000000.05343
subTotal0.07800100.000001.06859
DieDoped siliconSilicon (Si)7440-21-30.16000100.000002.19195
subTotal0.16000100.000002.19195
DieAluminium alloyAluminium (Al)7429-90-50.000450.280000.00614
Doped siliconSilicon (Si)7440-21-30.1595599.720002.18582
subTotal0.16000100.000002.19196
Lead FrameCopper alloyCopper (Cu)7440-50-82.5594195.1100035.06320
Magnesium (Mg)7439-95-40.005380.200000.07373
Nickel (Ni)7440-02-00.085303.170001.16865
Silicon (Si)7440-21-30.018570.690000.25438
Pure metal layerGold (Au)7440-57-50.000540.020000.00737
Nickel (Ni)7440-02-00.019910.740000.27281
Palladium (Pd)7440-05-30.001880.070000.02581
subTotal2.69100100.0000036.86595
Mould CompoundFillerSilica -amorphous-7631-86-90.8942423.0000012.25084
Silica fused60676-86-02.3328060.0000031.95870
Flame retardantMetal hydroxideProprietary0.116643.000001.59794
ImpurityBismuth (Bi)7440-69-90.019440.500000.26632
PigmentCarbon black1333-86-40.019440.500000.26632
PolymerEpoxy resin systemProprietary0.272167.000003.72852
Phenolic resinProprietary0.233286.000003.19587
subTotal3.88800100.0000053.26451
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00125
Tin solderTin (Sn)7440-31-50.1639099.940002.24541
subTotal0.16400100.000002.24676
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalGold (Au)7440-57-50.0144099.990000.19726
subTotal0.01440100.000000.19728
WirePure metalGold (Au)7440-57-50.14402100.000001.97303
subTotal0.14402100.000001.97303
total7.29942100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.