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Chemical content PMCXB1000UE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMCXB1000UESOT1216DFN1010B-61.23166 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070041147212601235Dongguan, China; Hsin-chu, Taiwan; Kwai Chung, Hong Kong 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000221.000000.01786
FillerSilver (Ag)7440-22-40.0184884.000001.50041
PolymerBismaleimidodiphenylmethane resin 0.0022010.000000.17862
Isobornyl Methacrylate7534-94-30.001105.000000.08931
subTotal0.02200100.000001.78620
DieDoped siliconSilicon (Si)7440-21-30.04000100.000003.24765
subTotal0.04000100.000003.24765
DieDoped siliconSilicon (Si)7440-21-30.04000100.000003.24765
subTotal0.04000100.000003.24765
Lead FrameCopper alloyCopper (Cu)7440-50-80.4476991.1800036.34881
Magnesium (Mg)7439-95-40.000830.170000.06777
Nickel (Ni)7440-02-00.013942.840001.13216
Silicon (Si)7440-21-30.003040.620000.24716
Pure metal layerGold (Au)7440-57-50.000340.070000.02791
Nickel (Ni)7440-02-00.023034.690001.86966
Palladium (Pd)7440-05-30.002110.430000.17142
subTotal0.49100100.0000039.86489
Mould CompoundFillerSilica -amorphous-7631-86-90.1393823.0000011.31643
Silica fused60676-86-00.3636060.0000029.52113
Flame retardantMetal hydroxideProprietary0.018183.000001.47606
ImpurityBismuth (Bi)7440-69-90.003030.500000.24601
PigmentCarbon black1333-86-40.003030.500000.24601
PolymerEpoxy resin systemProprietary0.042427.000003.44413
Phenolic resinProprietary0.036366.000002.95211
subTotal0.60600100.0000049.20188
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00009
Non hazardousProprietary0.000010.055500.00108
Tin solderTin (Sn)7440-31-50.0239999.940001.94742
subTotal0.02400100.000001.94859
WireImpurityNon hazardousProprietary0.000000.010000.00007
Pure metalGold (Au)7440-57-50.0086699.990000.70321
subTotal0.00866100.000000.70328
total1.23166100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.