Chemical content PMCXB900UE

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Type numberPackagePackage descriptionTotal product weight
PMCXB900UESOT1216DFN1010B-61.18405 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934067143147612601235Hsin-chu, Taiwan; Hsinchu, Taiwan; Sherman, United States Of America; Kwai Chung, Hong Kong; D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000201.000000.01689
FillerSilver (Ag)7440-22-40.0168084.000001.41886
PolymerBismaleimidodiphenylmethane resin 0.0020010.000000.16891
Isobornyl Methacrylate7534-94-30.001005.000000.08446
DieDoped siliconSilicon (Si)7440-21-30.03000100.000002.53368
Lead FrameCopper alloyChromium (Cr)7440-47-30.001180.240000.09932
Copper (Cu)7440-50-80.4649694.8900039.26870
Tin (Sn)7440-31-50.001180.240000.09932
Zinc (Zn)7440-66-60.001030.210000.08691
Pure metal layerGold (Au)7440-57-50.000240.050000.02069
Nickel (Ni)7440-02-00.020584.200001.73810
Palladium (Pd)7440-05-30.000830.170000.07035
Mould CompoundFillerSilica -amorphous-7631-86-90.1403023.0000011.84916
Silica fused60676-86-00.3660060.0000030.91086
Flame retardantMetal hydroxideProprietary0.018303.000001.54554
ImpurityBismuth (Bi)7440-69-90.003050.500000.25759
PigmentCarbon black1333-86-40.003050.500000.25759
PolymerEpoxy resin systemProprietary0.042707.000003.60627
Phenolic resinProprietary0.036606.000003.09109
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00008
Non hazardousProprietary0.000010.055500.00094
Tin solderTin (Sn)7440-31-50.0199999.940001.68810
WireImpurityNon hazardousProprietary0.000000.010000.00012
Pure metalGold (Au)7440-57-50.0140599.990001.18686
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.