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Chemical content PMCXB900UEL

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMCXB900UELSOT1216DFN1010B-61.21705 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070417147412601235Kwai Chung, Hong Kong; D-22529 HAMBURG, Germany; Hsinchu, Taiwan; Hsin-chu, Taiwan; Dongguan, China; Sherman, United States Of America 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000221.000000.01808
FillerSilver (Ag)7440-22-40.0184884.000001.51843
PolymerBismaleimidodiphenylmethane resin 0.0022010.000000.18076
Isobornyl Methacrylate7534-94-30.001105.000000.09038
subTotal0.02200100.000001.80765
DieDoped siliconSilicon (Si)7440-21-30.03000100.000002.46498
subTotal0.03000100.000002.46498
DieDoped siliconSilicon (Si)7440-21-30.03000100.000002.46498
subTotal0.03000100.000002.46498
Lead FrameCopper alloyCopper (Cu)7440-50-80.4476991.1800036.78516
Magnesium (Mg)7439-95-40.000830.170000.06858
Nickel (Ni)7440-02-00.013942.840001.14575
Silicon (Si)7440-21-30.003040.620000.25013
Pure metal layerGold (Au)7440-57-50.000340.070000.02824
Nickel (Ni)7440-02-00.023034.690001.89211
Palladium (Pd)7440-05-30.002110.430000.17348
subTotal0.49100100.0000040.34345
Mould CompoundFillerSilica -amorphous-7631-86-90.1393823.0000011.45228
Silica fused60676-86-00.3636060.0000029.87552
Flame retardantMetal hydroxideProprietary0.018183.000001.49378
ImpurityBismuth (Bi)7440-69-90.003030.500000.24896
PigmentCarbon black1333-86-40.003030.500000.24896
PolymerEpoxy resin systemProprietary0.042427.000003.48548
Phenolic resinProprietary0.036366.000002.98755
subTotal0.60600100.0000049.79253
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00009
Non hazardousProprietary0.000010.055500.00109
Tin solderTin (Sn)7440-31-50.0239999.940001.97080
subTotal0.02400100.000001.97198
WireImpurityNon hazardousProprietary0.000000.010000.00012
Pure metalGold (Au)7440-57-50.0140599.990001.15468
subTotal0.01405100.000001.15480
total1.21705100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.