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Chemical content PMDPB30XNA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMDPB30XNASOT1118HUSON67.30823 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934667308115212601235Kuching Sarawak, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000781.000000.01067
FillerSilver (Ag)7440-22-40.0655284.000000.89652
PolymerBismaleimidodiphenylmethane resin 0.0078010.000000.10673
Isobornyl Methacrylate7534-94-30.003905.000000.05336
subTotal0.07800100.000001.06728
DieDoped siliconSilicon (Si)7440-21-30.32881100.000004.49917
subTotal0.32881100.000004.49917
Lead FrameCopper alloyCopper (Cu)7440-50-82.5594195.1100035.02093
Magnesium (Mg)7439-95-40.005380.200000.07364
Nickel (Ni)7440-02-00.085303.170001.16724
Silicon (Si)7440-21-30.018570.690000.25407
Pure metal layerGold (Au)7440-57-50.000540.020000.00736
Nickel (Ni)7440-02-00.019910.740000.27248
Palladium (Pd)7440-05-30.001880.070000.02578
subTotal2.69100100.0000036.82150
Mould CompoundFillerSilica -amorphous-7631-86-90.8942423.0000012.23607
Silica fused60676-86-02.3328060.0000031.92018
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.116643.000001.59601
Ion trapping agentBismuth (Bi)7440-69-90.019440.500000.26600
PigmentCarbon black1333-86-40.019440.500000.26600
PolymerEpoxy resin systemProprietary0.272167.000003.72402
Phenolic resinProprietary0.233286.000003.19202
subTotal3.88800100.0000053.20030
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00125
Tin solderTin (Sn)7440-31-50.1639099.940002.24270
subTotal0.16400100.000002.24405
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalGold (Au)7440-57-50.0144099.990000.19702
subTotal0.01440100.000000.19704
WirePure metalGold (Au)7440-57-50.14402100.000001.97066
subTotal0.14402100.000001.97066
total7.30823100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.