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Chemical content PMDPB70XPE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMDPB70XPESOT1118 dummy POVHUSON67.29830 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934066844115412601235Hsin-chu, Taiwan; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000781.000000.01069
FillerSilver (Ag)7440-22-40.0655284.000000.89774
PolymerBismaleimidodiphenylmethane resin 0.0078010.000000.10687
Isobornyl Methacrylate7534-94-30.003905.000000.05344
subTotal0.07800100.000001.06874
DieDoped siliconSilicon (Si)7440-21-30.42000100.000005.75476
subTotal0.42000100.000005.75476
Lead FrameCopper alloyCopper (Cu)7440-50-82.5594195.1100035.06858
Magnesium (Mg)7439-95-40.005380.200000.07374
Nickel (Ni)7440-02-00.085303.170001.16883
Silicon (Si)7440-21-30.018570.690000.25441
Pure metal layerGold (Au)7440-57-50.000540.020000.00737
Nickel (Ni)7440-02-00.019910.740000.27285
Palladium (Pd)7440-05-30.001880.070000.02581
subTotal2.69100100.0000036.87159
Mould CompoundFillerSilica -amorphous-7631-86-90.8942423.0000012.25272
Silica fused60676-86-02.3328060.0000031.96361
Flame retardantMetal hydroxideProprietary0.116643.000001.59818
ImpurityBismuth (Bi)7440-69-90.019440.500000.26636
PigmentCarbon black1333-86-40.019440.500000.26636
PolymerEpoxy resin systemProprietary0.272167.000003.72909
Phenolic resinProprietary0.233286.000003.19636
subTotal3.88800100.0000053.27268
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00125
Tin solderTin (Sn)7440-31-50.1639099.940002.24575
subTotal0.16400100.000002.24710
WireImpurityNon hazardousProprietary0.000000.010000.00001
Pure metalGold (Au)7440-57-50.0091799.990000.12561
subTotal0.00917100.000000.12562
WirePure metalGold (Au)7440-57-50.04813100.000000.65951
subTotal0.04813100.000000.65951
total7.29830100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.