Chemical content PMDPB85UPE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC	OPN	Type No.	Package	State	MSL
934066843115	PMDPB85UPE,115	PMDPB85UPE	SOT1118 (HUSON6)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHS	Compliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 14626 ppm; substance 1333-86-4: 2702 ppm; substance 7439-92-1: <1 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 14626 ppm; substance 1333-86-4: 2702 ppm; substance 7439-92-1: <1 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 8675 ppm; substance 7440-05-3: 263 ppm; substance 7440-57-5: 10141 ppm;
RHF Indicator	Lead-free and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Adhesive	Filler	Silver (Ag)	7440-22-4	0.062400	80.000000	0.867460
Adhesive	Polymer	Poly(isobornyl) methacrylate	64114-51-8	0.007800	10.000000	0.108433
Adhesive	Polymer	Bismaleimide resin		0.006825	8.750000	0.094878
Adhesive	Polymer	Polysiloxanes	63148-53-8	0.000780	1.000000	0.010843
Adhesive	Polymer	Acrylic resin		0.000187	0.240000	0.002600
Adhesive	Curing accelerators/Catalyst	Palladium (Pd)	7440-05-3	0.000008	0.010000	0.000111
		Adhesive Total		0.078000	100.000000	1.084325

Die	Doped silicon	Silicon (Si)	7440-21-3	0.300000	100.000000	4.170482
		Die Total		0.300000	100.000000	4.170482

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	2.559410	95.110000	35.579907
Lead Frame	Copper alloy	Nickel (Ni)	7440-02-0	0.085305	3.170000	1.185876
Lead Frame	Copper alloy	Silicon (Si)	7440-21-3	0.018568	0.690000	0.258125
Lead Frame	Copper alloy	Magnesium (Mg)	7439-95-4	0.005382	0.200000	0.074818
		Base Alloy Total		2.668665	99.170000	37.098726
Lead Frame	Pure metal layer	Nickel (Ni)	7440-02-0	0.019913	0.740000	0.276823
		Pre-Plating 1 Total		0.019913	0.740000	0.276823
Lead Frame	Pure metal layer	Palladium (Pd)	7440-05-3	0.001884	0.070000	0.026191
		Pre-Plating 2 Total		0.001884	0.070000	0.026191
Lead Frame	Pure metal layer	Gold (Au)	7440-57-5	0.000538	0.020000	0.007479
		Pre-Plating 3 Total		0.000538	0.020000	0.007479
		Lead Frame Total		2.691000	100.000000	37.409219

Mould Compound	Filler	Silica fused	60676-86-0	2.332800	60.000000	32.429664
Mould Compound	Filler	Silica	7631-86-9	0.894240	23.000000	12.431371
Mould Compound	Polymer	Epoxy resin system		0.272160	7.000000	3.783461
Mould Compound	Polymer	Phenolic resin		0.233280	6.000000	3.242967
Mould Compound	Flame retardant	Aluminium hydroxide (Al(OH)3)	21645-51-2	0.116640	3.000000	1.621483
Mould Compound	Ion trapping agent	Bismuth (Bi)	7440-69-9	0.019440	0.500000	0.270247
Mould Compound	Pigment	Carbon black	1333-86-4	0.019440	0.500000	0.270247
		Mould Compound Total		3.888000	100.000000	54.049440

Post-Plating	Tin solder	Tin (Sn)	7440-31-5	0.163902	99.940000	2.278501
Post-Plating	Impurity	Non-declarable		0.000091	0.055500	0.001265
Post-Plating	Impurity	Lead (Pb)	7439-92-1	0.000007	0.004500	0.000097
		Post-Plating Total		0.164000	100.000000	2.279863

Wire 1	Pure metal	Gold (Au)	7440-57-5	0.060678	100.000000	0.843522
		Wire 1 Total		0.060678	100.000000	0.843522

Wire 2	Pure metal	Gold (Au)	7440-57-5	0.011735	99.990000	0.163135
Wire 2	Impurity	Non-declarable		0.000001	0.010000	0.000014
		Wire 2 Total		0.011736	100.000000	0.163149

		PMDPB85UPE Total		7.193414		100.000000

Notes
Report created on 2025-04-22 11:32:28 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2025-04-22 11:32:28 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名称 Material	有毒或有害物质和元素 (Toxic or hazardous substances and elements)
部件名称 Material	铅 (Pb)	镉 (Cd)	汞 (Hg)	六价铬 (Cr⁶⁺)	多溴联苯 (PBB)	多溴二苯醚 (PBDE)
胶黏剂 (Adhesive)	◯	◯	◯	◯	◯	◯
半导体芯片 (Die)	◯	◯	◯	◯	◯	◯
基底合金 (Base Alloy)	◯	◯	◯	◯	◯	◯
预镀层1 (Pre-Plating 1)	◯	◯	◯	◯	◯	◯
预镀层2 (Pre-Plating 2)	◯	◯	◯	◯	◯	◯
预镀层3 (Pre-Plating 3)	◯	◯	◯	◯	◯	◯
模封料 (Mould Compound)	◯	◯	◯	◯	◯	◯
后镀层 (Post-Plating)	◯	◯	◯	◯	◯	◯
导线 (Wire)	◯	◯	◯	◯	◯	◯
导线 (Wire)	◯	◯	◯	◯	◯	◯

◯	表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
✕	表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
	该半导体产品具有无限期的环保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2025-04-22 11:32:28 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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Chemical content PMDPB85UPE

Bipolar transistors

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ESD protection, TVS, filtering and signal conditioning

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Analog & Logic ICs

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Chemical content PMDPB85UPE