Chemical content PMDPB85UPE

As a proactive and sustainable company, Nexperia has decided to publish chemical content information of its product portfolio through direct Internet access. With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status. Nexperia has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database. Nexperia products are compliant to the EU Directives RoHS, ELV and the China RoHS. Please see also our Restricted Substances Declaration.

Type numberPackagePackage descriptionTotal product weight
PMDPB85UPESOT1118 dummy POVHUSON67.19341 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340668431154126030 s123520 s3Hsin-chu, Taiwan; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000781.000000.01084
FillerSilver (Ag)7440-22-40.0655284.000000.91083
PolymerBismaleimidodiphenylmethane resin 0.0078010.000000.10843
Isobornyl Methacrylate7534-94-30.003905.000000.05422
DieDoped siliconSilicon (Si)7440-21-30.30000100.000004.17048
Lead FrameCopper alloyCopper (Cu)7440-50-82.5594195.1100035.57993
Magnesium (Mg)7439-95-40.005380.200000.07482
Nickel (Ni)7440-02-00.085303.170001.18587
Silicon (Si)7440-21-30.018570.690000.25812
Pure metal layerGold (Au)7440-57-50.000540.020000.00748
Nickel (Ni)7440-02-00.019910.740000.27683
Palladium (Pd)7440-05-30.001880.070000.02619
Mould CompoundFillerSilica -amorphous-7631-86-90.7776020.0000010.80989
Silica fused60676-86-02.5077664.5000034.86191
Flame retardantMetal hydroxideProprietary0.116643.000001.62148
ImpuritySilicon Dioxide (SiO2)14808-60-70.019440.500000.27025
PigmentCarbon black1333-86-40.011660.300000.16215
PolymerPhenol Formaldehyde resin (generic)9003-35-40.085542.200001.18909
Phenolic resinProprietary0.097202.500001.35124
Tetramethylbiphenyl diglycidyl ether85954-11-60.272167.000003.78346
Post-PlatingImpurityAntimony (Sb)7440-36-00.000020.010000.00023
Bismuth (Bi)7440-69-90.000030.020000.00046
Iron (Fe)7439-89-60.000020.010000.00023
Lead (Pb)7439-92-10.000020.010000.00023
Tin solderTin (Sn)7440-31-50.1639299.950002.27872
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalGold (Au)7440-57-50.0117399.990000.16313
WirePure metalGold (Au)7440-57-50.06068100.000000.84352
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.