Chemical content PMDPB85UPE

As a proactive and sustainable company, Nexperia has decided to publish chemical content information of its product portfolio through direct Internet access. With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status. Nexperia has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database. Nexperia products are compliant to the EU Directives RoHS, ELV and the China RoHS. Please see also our Restricted Substances Declaration.

Download chemical content (.PDF)

Type number	Package	Package description	Total product weight
PMDPB85UPE	SOT1118 dummy POV	HUSON6	7.19341 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
934066843115	4	1	260	30 s	1	235	20 s	3	Hsin-chu, Taiwan; Dongguan, China

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Adhesive	Additive	Non hazardous	Proprietary	0.00078	1.00000	0.01084
	Filler	Silver (Ag)	7440-22-4	0.06552	84.00000	0.91083
	Polymer	Bismaleimidodiphenylmethane resin		0.00780	10.00000	0.10843
		Isobornyl Methacrylate	7534-94-3	0.00390	5.00000	0.05422
		subTotal		0.07800	100.00000	1.08432

Die	Doped silicon	Silicon (Si)	7440-21-3	0.30000	100.00000	4.17048
		subTotal		0.30000	100.00000	4.17048

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	2.55941	95.11000	35.57993
		Magnesium (Mg)	7439-95-4	0.00538	0.20000	0.07482
		Nickel (Ni)	7440-02-0	0.08530	3.17000	1.18587
		Silicon (Si)	7440-21-3	0.01857	0.69000	0.25812
	Pure metal layer	Gold (Au)	7440-57-5	0.00054	0.02000	0.00748
		Nickel (Ni)	7440-02-0	0.01991	0.74000	0.27683
		Palladium (Pd)	7440-05-3	0.00188	0.07000	0.02619
		subTotal		2.69100	100.00000	37.40924

Mould Compound	Filler	Silica -amorphous-	7631-86-9	0.77760	20.00000	10.80989
		Silica fused	60676-86-0	2.50776	64.50000	34.86191
	Flame retardant	Metal hydroxide	Proprietary	0.11664	3.00000	1.62148
	Impurity	Silicon Dioxide (SiO2)	14808-60-7	0.01944	0.50000	0.27025
	Pigment	Carbon black	1333-86-4	0.01166	0.30000	0.16215
	Polymer	Phenol Formaldehyde resin (generic)	9003-35-4	0.08554	2.20000	1.18909
		Phenolic resin	Proprietary	0.09720	2.50000	1.35124
		Tetramethylbiphenyl diglycidyl ether	85954-11-6	0.27216	7.00000	3.78346
		subTotal		3.88800	100.00000	54.04947

Post-Plating	Impurity	Antimony (Sb)	7440-36-0	0.00002	0.01000	0.00023
		Bismuth (Bi)	7440-69-9	0.00003	0.02000	0.00046
		Iron (Fe)	7439-89-6	0.00002	0.01000	0.00023
		Lead (Pb)	7439-92-1	0.00002	0.01000	0.00023
	Tin solder	Tin (Sn)	7440-31-5	0.16392	99.95000	2.27872
		subTotal		0.16400	100.00000	2.27987

Wire	Impurity	Non hazardous	Proprietary	0.00000	0.01000	0.00002
	Pure metal	Gold (Au)	7440-57-5	0.01173	99.99000	0.16313
		subTotal		0.01174	100.00000	0.16315

Wire	Pure metal	Gold (Au)	7440-57-5	0.06068	100.00000	0.84352
		subTotal		0.06068	100.00000	0.84352

		total		7.19341	100.00000	100.00000

Note(s):
¹This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.