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Chemical content PMDXB290UNE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMDXB290UNESOT1216DFN1010B-61.22910 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934665536147312601235Dongguan, China; Hsin-chu, Taiwan; Sherman, United States Of America; Kwai Chung, Hong Kong; Hsinchu, Taiwan; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000221.000000.01790
FillerSilver (Ag)7440-22-40.0184884.000001.50354
PolymerBismaleimidodiphenylmethane resin 0.0022010.000000.17899
Isobornyl Methacrylate7534-94-30.001105.000000.08950
subTotal0.02200100.000001.78993
DieDoped siliconSilicon (Si)7440-21-30.08000100.000006.50883
subTotal0.08000100.000006.50883
Lead FrameCopper alloyCopper (Cu)7440-50-80.4476991.1800036.42452
Magnesium (Mg)7439-95-40.000830.170000.06791
Nickel (Ni)7440-02-00.013942.840001.13452
Silicon (Si)7440-21-30.003040.620000.24768
Pure metal layerGold (Au)7440-57-50.000340.070000.02796
Nickel (Ni)7440-02-00.023034.690001.87356
Palladium (Pd)7440-05-30.002110.430000.17178
subTotal0.49100100.0000039.94793
Mould CompoundFillerSilica -amorphous-7631-86-90.1393823.0000011.34000
Silica fused60676-86-00.3636060.0000029.58262
Flame retardantMetal hydroxideProprietary0.018183.000001.47913
ImpurityBismuth (Bi)7440-69-90.003030.500000.24652
PigmentCarbon black1333-86-40.003030.500000.24652
PolymerEpoxy resin systemProprietary0.042427.000003.45131
Phenolic resinProprietary0.036366.000002.95826
subTotal0.60600100.0000049.30436
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00009
Non hazardousProprietary0.000010.055500.00108
Tin solderTin (Sn)7440-31-50.0239999.940001.95148
subTotal0.02400100.000001.95265
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0061099.990000.49625
subTotal0.00610100.000000.49630
total1.22910100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.