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Chemical content PMDXB950UPEL

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMDXB950UPELSOT1216DFN1010B-61.20910 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070431147412601235Hsin-chu, Taiwan; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000221.000000.01820
FillerSilver (Ag)7440-22-40.0184884.000001.52841
PolymerBismaleimidodiphenylmethane resin 0.0022010.000000.18195
Isobornyl Methacrylate7534-94-30.001105.000000.09098
subTotal0.02200100.000001.81954
DieDoped siliconSilicon (Si)7440-21-30.06000100.000004.96237
subTotal0.06000100.000004.96237
Lead FrameCopper alloyCopper (Cu)7440-50-80.4476991.1800037.02703
Magnesium (Mg)7439-95-40.000830.170000.06903
Nickel (Ni)7440-02-00.013942.840001.15329
Silicon (Si)7440-21-30.003040.620000.25177
Pure metal layerGold (Au)7440-57-50.000340.070000.02843
Nickel (Ni)7440-02-00.023034.690001.90455
Palladium (Pd)7440-05-30.002110.430000.17462
subTotal0.49100100.0000040.60872
Mould CompoundFillerSilica -amorphous-7631-86-90.1393823.0000011.52758
Silica fused60676-86-00.3636060.0000030.07195
Flame retardantMetal hydroxideProprietary0.018183.000001.50360
ImpurityBismuth (Bi)7440-69-90.003030.500000.25060
PigmentCarbon black1333-86-40.003030.500000.25060
PolymerEpoxy resin systemProprietary0.042427.000003.50839
Phenolic resinProprietary0.036366.000003.00720
subTotal0.60600100.0000050.11992
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00009
Non hazardousProprietary0.000010.055500.00110
Tin solderTin (Sn)7440-31-50.0239999.940001.98376
subTotal0.02400100.000001.98495
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0061099.990000.50446
subTotal0.00610100.000000.50451
total1.20910100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.