Chemical content PMEG030V050EPE

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Type numberPackagePackage descriptionTotal product weight
PMEG030V050EPESOT1289BCFP1572.63100 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934662465139212601235D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.02100100.000001.40574
ClipCopper alloyCopper (Cu)7440-50-87.3482299.8400010.11720
Iron (Fe)7439-89-60.011040.150000.01520
MetallisationCopper (Cu)7440-50-80.000740.010000.00101
Lead FrameCopper alloyCopper (Cu)7440-50-834.4217499.8600047.39263
Iron (Fe)7439-89-60.034470.100000.04746
Phosphorus (P)7723-14-00.013790.040000.01898
Mould CompoundFillerSilica -amorphous-7631-86-92.0660010.000002.84452
Silica fused60676-86-015.4950075.0000021.33387
PigmentCarbon black1333-86-40.061980.300000.08534
PolymerEpoxy resin systemProprietary1.590827.700002.19028
Phenolic resinProprietary1.446207.000001.99116
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00000
Bismuth (Bi)7440-69-90.000000.001000.00000
Copper (Cu)7440-50-80.000000.001000.00000
Lead (Pb)7439-92-10.000000.005000.00001
Tin solderTin (Sn)7440-31-50.0899999.990000.12390
Solder PasteLead alloyLead (Pb)7439-92-18.6236595.5000011.87324
Silver alloySilver (Ag)7440-22-40.225752.500000.31082
Tin alloyTin (Sn)7440-31-50.180602.000000.24865
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.