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Chemical content PMEG045T030EPD

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Type numberPackagePackage descriptionTotal product weight
PMEG045T030EPDSOT1289CFP1572.52000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070408146312601235Seremban, Malaysia; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.91000100.000001.25483
subTotal0.91000100.000001.25483
ClipCopper alloyCopper (Cu)7440-50-87.3482299.8400010.13269
Iron (Fe)7439-89-60.011040.150000.01522
MetallisationCopper (Cu)7440-50-80.000740.010000.00101
subTotal7.36000100.0000010.14892
Lead FrameCopper alloyCopper (Cu)7440-50-833.8529998.2100046.68090
Iron (Fe)7439-89-60.003450.010000.00475
Phosphorus (P)7723-14-00.013790.040000.01901
Pure metal layerCopper (Cu)7440-50-80.027580.080000.03803
Silver (Ag)7440-22-40.572201.660000.78903
subTotal34.47000100.0000047.53172
Mould CompoundFillerSilica fused60676-86-014.6686071.0000020.22697
PigmentCarbon black1333-86-40.061980.300000.08547
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-24.0700219.700005.61227
Phenolic resinProprietary1.859409.000002.56398
subTotal20.66000100.0000028.48869
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00000
Bismuth (Bi)7440-69-90.000000.001000.00000
Copper (Cu)7440-50-80.000000.001000.00000
Lead (Pb)7439-92-10.000000.005000.00001
Tin solderTin (Sn)7440-31-50.0899999.990000.12409
subTotal0.09000100.000000.12410
Solder PasteLead alloyLead (Pb)7439-92-18.6236595.5000011.89141
Silver alloySilver (Ag)7440-22-40.225752.500000.31129
Tin alloyTin (Sn)7440-31-50.180602.000000.24903
subTotal9.03000100.0000012.45173
total72.52000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.