Chemical content PMEG045T030EPD

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Type numberPackagePackage descriptionTotal product weight
PMEG045T030EPDSOT1289CFP1572.52000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934070408146312601235Seremban, Malaysia; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.91000100.000001.25483
ClipCopper alloyCopper (Cu)7440-50-87.3482299.8400010.13269
Iron (Fe)7439-89-60.011040.150000.01522
MetallisationCopper (Cu)7440-50-80.000740.010000.00101
Lead FrameCopper alloyCopper (Cu)7440-50-833.8529998.2100046.68090
Iron (Fe)7439-89-60.003450.010000.00475
Phosphorus (P)7723-14-00.013790.040000.01901
Pure metal layerCopper (Cu)7440-50-80.027580.080000.03803
Silver (Ag)7440-22-40.572201.660000.78903
Mould CompoundFillerSilica fused60676-86-014.6686071.0000020.22697
PigmentCarbon black1333-86-40.061980.300000.08547
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-24.0700219.700005.61227
Phenolic resinProprietary1.859409.000002.56398
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00000
Bismuth (Bi)7440-69-90.000000.001000.00000
Copper (Cu)7440-50-80.000000.001000.00000
Lead (Pb)7439-92-10.000000.005000.00001
Tin solderTin (Sn)7440-31-50.0899999.990000.12409
Solder PasteLead alloyLead (Pb)7439-92-18.6236595.5000011.89141
Silver alloySilver (Ag)7440-22-40.225752.500000.31129
Tin alloyTin (Sn)7440-31-50.180602.000000.24903
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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