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Chemical content PMEG050T150EIPD

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Type numberPackagePackage descriptionTotal product weight
PMEG050T150EIPDSOT1289CFP1573.47000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934661343139212601235D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
934661343146212601235D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.86000100.000002.53165
subTotal1.86000100.000002.53165
ClipCopper alloyCopper (Cu)7440-50-87.3460299.810009.99866
Iron (Fe)7439-89-60.011040.150000.01503
Phosphorus (P)7723-14-00.002940.040000.00401
subTotal7.36000100.0000010.01770
Lead FrameCopper alloyCopper (Cu)7440-50-833.8529998.2100046.07729
Iron (Fe)7439-89-60.003450.010000.00469
Phosphorus (P)7723-14-00.013790.040000.01877
Pure metal layerCopper (Cu)7440-50-80.027580.080000.03753
Silver (Ag)7440-22-40.572201.660000.77882
subTotal34.47000100.0000046.91710
Mould CompoundFillerSilica fused60676-86-014.6686071.0000019.96543
PigmentCarbon black1333-86-40.061980.300000.08436
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-24.0700219.700005.53970
Phenolic resinProprietary1.859409.000002.53083
subTotal20.66000100.0000028.12032
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00000
Bismuth (Bi)7440-69-90.000000.001000.00000
Copper (Cu)7440-50-80.000000.001000.00000
Lead (Pb)7439-92-10.000000.005000.00001
Tin solderTin (Sn)7440-31-50.0899999.990000.12249
subTotal0.09000100.000000.12250
Solder PasteLead alloyLead (Pb)7439-92-18.6236595.5000011.73765
Silver alloySilver (Ag)7440-22-40.225752.500000.30727
Tin alloyTin (Sn)7440-31-50.180602.000000.24581
subTotal9.03000100.0000012.29073
total73.47000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.