×

Chemical content PMEG060V030EPD

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG060V030EPDSOT1289CFP1572.69000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070194146512601235Seremban, Malaysia; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.08000100.000001.48576
subTotal1.08000100.000001.48576
ClipCopper alloyCopper (Cu)7440-50-87.3482299.8400010.10899
Iron (Fe)7439-89-60.011040.150000.01519
MetallisationCopper (Cu)7440-50-80.000740.010000.00101
subTotal7.36000100.0000010.12519
Lead FrameCopper alloyCopper (Cu)7440-50-833.8529998.2100046.57173
Iron (Fe)7439-89-60.003450.010000.00474
Phosphorus (P)7723-14-00.013790.040000.01897
Pure metal layerCopper (Cu)7440-50-80.027580.080000.03794
Silver (Ag)7440-22-40.572201.660000.78718
subTotal34.47000100.0000047.42056
Mould CompoundFillerSilica fused60676-86-014.6686071.0000020.17967
PigmentCarbon black1333-86-40.061980.300000.08527
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-24.0700219.700005.59915
Phenolic resinProprietary1.859409.000002.55799
subTotal20.66000100.0000028.42208
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00000
Bismuth (Bi)7440-69-90.000000.001000.00000
Copper (Cu)7440-50-80.000000.001000.00000
Lead (Pb)7439-92-10.000000.005000.00001
Tin solderTin (Sn)7440-31-50.0899999.990000.12380
subTotal0.09000100.000000.12381
Solder PasteLead alloyLead (Pb)7439-92-18.6236595.5000011.86360
Silver alloySilver (Ag)7440-22-40.225752.500000.31057
Tin alloyTin (Sn)7440-31-50.180602.000000.24845
subTotal9.03000100.0000012.42262
total72.69000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.