×

Chemical content PMEG060V050EPD

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG060V050EPDSOT1289CFP1572.15000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934067905146212601235D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
934067905139112601235D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.54000100.000000.74844
subTotal0.54000100.000000.74844
ClipCopper alloyCopper (Cu)7440-50-87.3460299.8100010.18159
Iron (Fe)7439-89-60.011040.150000.01530
Phosphorus (P)7723-14-00.002940.040000.00408
subTotal7.36000100.0000010.20097
Lead FrameCopper alloyCopper (Cu)7440-50-833.8529998.2100046.92029
Iron (Fe)7439-89-60.003450.010000.00478
Phosphorus (P)7723-14-00.013790.040000.01911
Pure metal layerCopper (Cu)7440-50-80.027580.080000.03822
Silver (Ag)7440-22-40.572201.660000.79307
subTotal34.47000100.0000047.77547
Mould CompoundFillerSilica fused60676-86-014.6686071.0000020.33070
PigmentCarbon black1333-86-40.061980.300000.08590
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-24.0700219.700005.64105
Phenolic resinProprietary1.859409.000002.57713
subTotal20.66000100.0000028.63478
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00000
Bismuth (Bi)7440-69-90.000000.001000.00000
Copper (Cu)7440-50-80.000000.001000.00000
Lead (Pb)7439-92-10.000000.005000.00001
Tin solderTin (Sn)7440-31-50.0899999.990000.12473
subTotal0.09000100.000000.12474
Solder PasteLead alloyLead (Pb)7439-92-18.6236595.5000011.95239
Silver alloySilver (Ag)7440-22-40.225752.500000.31289
Tin alloyTin (Sn)7440-31-50.180602.000000.25031
subTotal9.03000100.0000012.51559
total72.15000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.