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Chemical content PMEG10020AELP-Q

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Type numberPackagePackage descriptionTotal product weight
PMEG10020AELP-QSOD128FlatPower34.02000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662883115112601235Suzhou, China; Seremban, Malaysia; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.74000100.000002.17519
subTotal0.74000100.000002.17519
ClipCopper alloyCopper (Cu)7440-50-87.2805299.8700021.40071
Iron (Fe)7439-89-60.007290.100000.02143
Phosphorus (P)7723-14-00.002190.030000.00643
subTotal7.29000100.0000021.42857
Lead FrameCopper alloyCopper (Cu)7440-50-811.6332498.4200034.19531
Iron (Fe)7439-89-60.011820.100000.03474
Phosphorus (P)7723-14-00.003550.030000.01042
Pure metal layerSilver (Ag)7440-22-40.171391.450000.50379
subTotal11.82000100.0000034.74426
Mould CompoundFillerSilica fused60676-86-08.0372071.0000023.62493
PigmentCarbon black1333-86-40.033960.300000.09982
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-22.2300419.700006.55509
Phenolic resinProprietary1.018809.000002.99471
subTotal11.32000100.0000033.27455
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00003
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000020.005000.00005
Tin solderTin (Sn)7440-31-50.3499699.990001.02870
subTotal0.35000100.000001.02880
Solder PasteLead alloyLead (Pb)7439-92-12.3125092.500006.79747
Silver alloySilver (Ag)7440-22-40.062502.500000.18372
Tin alloyTin (Sn)7440-31-50.125005.000000.36743
subTotal2.50000100.000007.34862
total34.02000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.