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Chemical content PMEG10020AELP

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Type numberPackagePackage descriptionTotal product weight
PMEG10020AELPSOD128FlatPower32.76800 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934069175115412601235Suzhou, China; Seremban, Malaysia; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.67100100.000002.04773
subTotal0.67100100.000002.04773
ClipCopper alloyCopper (Cu)7440-50-85.2098599.8630015.89921
Iron (Fe)7439-89-60.005160.099000.01576
Phosphorus (P)7723-14-00.001980.038000.00605
subTotal5.21700100.0000015.92102
Lead FrameCopper alloyCopper (Cu)7440-50-811.8046399.8700036.02488
Iron (Fe)7439-89-60.011230.095000.03427
Phosphorus (P)7723-14-00.004140.035000.01263
subTotal11.82000100.0000036.07178
Mould CompoundFillerSilica -amorphous-7631-86-91.2210010.000003.72620
Silica fused60676-86-09.1575075.0000027.94647
PigmentCarbon black1333-86-40.036630.300000.11179
PolymerEpoxy resin systemProprietary0.940177.700002.86917
Phenolic resinProprietary0.854707.000002.60834
subTotal12.21000100.0000037.26197
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00003
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000020.005000.00005
Tin solderTin (Sn)7440-31-50.3499699.990001.06801
subTotal0.35000100.000001.06811
Solder PasteLead alloyLead (Pb)7439-92-12.3125092.500007.05719
Silver alloySilver (Ag)7440-22-40.062502.500000.19073
Tin alloyTin (Sn)7440-31-50.125005.000000.38147
subTotal2.50000100.000007.62939
total32.76800100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.