Chemical content PMEG100T080ELPE

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Type numberPackagePackage descriptionTotal product weight
PMEG100T080ELPESOT1289BCFP1573.35000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934661558139312601235D-22529 HAMBURG, Germany; Seremban, Malaysia; Nijmegen, NetherlandsLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.74000100.000002.37219
ClipCopper alloyCopper (Cu)7440-50-87.3460299.8100010.01502
Iron (Fe)7439-89-60.011040.150000.01505
Phosphorus (P)7723-14-00.002940.040000.00401
Lead FrameCopper alloyCopper (Cu)7440-50-834.4217499.8600046.92807
Iron (Fe)7439-89-60.034470.100000.04699
Phosphorus (P)7723-14-00.013790.040000.01880
Mould CompoundFillerSilica -amorphous-7631-86-92.0660010.000002.81663
Silica fused60676-86-015.4950075.0000021.12474
PigmentCarbon black1333-86-40.061980.300000.08450
PolymerEpoxy resin systemProprietary1.590827.700002.16881
Phenolic resinProprietary1.446207.000001.97164
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00000
Bismuth (Bi)7440-69-90.000000.001000.00000
Copper (Cu)7440-50-80.000000.001000.00000
Lead (Pb)7439-92-10.000000.005000.00001
Tin solderTin (Sn)7440-31-50.0899999.990000.12269
Solder PasteLead alloyLead (Pb)7439-92-18.6236595.5000011.75685
Silver alloySilver (Ag)7440-22-40.225752.500000.30777
Tin alloyTin (Sn)7440-31-50.180602.000000.24622
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.