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Chemical content PMEG100T200ELPE

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Type numberPackagePackage descriptionTotal product weight
PMEG100T200ELPESOT1289BCFP1578.82000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934661563139412601235D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-33.79000100.000004.80842
subTotal3.79000100.000004.80842
ClipCopper alloyCopper (Cu)7440-50-810.7657799.8680013.65868
Iron (Fe)7439-89-60.010560.098000.01340
Phosphorus (P)7723-14-00.003670.034000.00465
subTotal10.78000100.0000013.67673
Lead FrameCopper alloyCopper (Cu)7440-50-834.4217499.8600043.67133
Iron (Fe)7439-89-60.034470.100000.04373
Phosphorus (P)7723-14-00.013790.040000.01749
subTotal34.47000100.0000043.73255
Mould CompoundFillerSilica -amorphous-7631-86-92.0660010.000002.62116
Silica fused60676-86-015.4950075.0000019.65872
PigmentCarbon black1333-86-40.061980.300000.07863
PolymerEpoxy resin systemProprietary1.590827.700002.01829
Phenolic resinProprietary1.446207.000001.83481
subTotal20.66000100.0000026.21161
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00000
Bismuth (Bi)7440-69-90.000000.001000.00000
Copper (Cu)7440-50-80.000000.001000.00000
Lead (Pb)7439-92-10.000000.005000.00001
Tin solderTin (Sn)7440-31-50.0899999.990000.11417
subTotal0.09000100.000000.11418
Solder PasteLead alloyLead (Pb)7439-92-18.6236595.5000010.94094
Silver alloySilver (Ag)7440-22-40.225752.500000.28641
Tin alloyTin (Sn)7440-31-50.180602.000000.22913
subTotal9.03000100.0000011.45648
total78.82000100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.