Chemical content PMEG100T200ELPE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG100T200ELPESOT1289BCFP1578.82000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934661563139412601235D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-33.79000100.000004.80842
ClipCopper alloyCopper (Cu)7440-50-810.7657799.8680013.65868
Iron (Fe)7439-89-60.010560.098000.01340
Phosphorus (P)7723-14-00.003670.034000.00465
Lead FrameCopper alloyCopper (Cu)7440-50-834.4217499.8600043.67133
Iron (Fe)7439-89-60.034470.100000.04373
Phosphorus (P)7723-14-00.013790.040000.01749
Mould CompoundFillerSilica -amorphous-7631-86-92.0660010.000002.62116
Silica fused60676-86-015.4950075.0000019.65872
PigmentCarbon black1333-86-40.061980.300000.07863
PolymerEpoxy resin systemProprietary1.590827.700002.01829
Phenolic resinProprietary1.446207.000001.83481
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00000
Bismuth (Bi)7440-69-90.000000.001000.00000
Copper (Cu)7440-50-80.000000.001000.00000
Lead (Pb)7439-92-10.000000.005000.00001
Tin solderTin (Sn)7440-31-50.0899999.990000.11417
Solder PasteLead alloyLead (Pb)7439-92-18.6236595.5000010.94094
Silver alloySilver (Ag)7440-22-40.225752.500000.28641
Tin alloyTin (Sn)7440-31-50.180602.000000.22913
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.