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Chemical content PMEG100T20ELP

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Type numberPackagePackage descriptionTotal product weight
PMEG100T20ELPSOD128FlatPower32.62700 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660179115512601235D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.53000100.000001.62442
subTotal0.53000100.000001.62442
ClipCopper alloyCopper (Cu)7440-50-85.2097099.8600015.96744
Iron (Fe)7439-89-60.005220.100000.01599
Phosphorus (P)7723-14-00.002090.040000.00640
subTotal5.21700100.0000015.98983
Lead FrameCopper alloyCopper (Cu)7440-50-811.6332498.4200035.65527
Iron (Fe)7439-89-60.011820.100000.03623
Phosphorus (P)7723-14-00.003550.030000.01087
Pure metal layerSilver (Ag)7440-22-40.171391.450000.52530
subTotal11.82000100.0000036.22767
Mould CompoundFillerSilica -amorphous-7631-86-91.2210010.000003.74230
Silica fused60676-86-09.1575075.0000028.06724
PigmentCarbon black1333-86-40.036630.300000.11227
PolymerEpoxy resin systemProprietary0.940177.700002.88157
Phenolic resinProprietary0.854707.000002.61961
subTotal12.21000100.0000037.42299
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00003
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000020.005000.00005
Tin solderTin (Sn)7440-31-50.3499699.990001.07262
subTotal0.35000100.000001.07272
Solder PasteLead alloyLead (Pb)7439-92-12.3125092.500007.08769
Silver alloySilver (Ag)7440-22-40.062502.500000.19156
Tin alloyTin (Sn)7440-31-50.125005.000000.38312
subTotal2.50000100.000007.66237
total32.62700100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.