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Chemical content PMEG100T20ELR-Q

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Type numberPackagePackage descriptionTotal product weight
PMEG100T20ELR-QSOD123WSOD217.04000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662805115212601235Seremban, Malaysia; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.53000100.000003.11033
subTotal0.53000100.000003.11033
ClipCopper alloyCopper (Cu)7440-50-83.1752399.8500018.63398
Iron (Fe)7439-89-60.003820.120000.02239
Phosphorus (P)7723-14-00.000950.030000.00560
subTotal3.18000100.0000018.66197
Lead FrameCopper alloyCopper (Cu)7440-50-85.4156798.1100031.78211
Iron (Fe)7439-89-60.005520.100000.03239
Phosphorus (P)7723-14-00.001660.030000.00972
Pure metal layerSilver (Ag)7440-22-40.097151.760000.57014
subTotal5.52000100.0000032.39436
Mould CompoundFillerSilica -amorphous-7631-86-90.6680010.000003.92019
Silica fused60676-86-05.0100075.0000029.40141
PigmentCarbon black1333-86-40.020040.300000.11761
PolymerEpoxy resin systemProprietary0.514367.700003.01854
Phenolic resinProprietary0.467607.000002.74413
subTotal6.68000100.0000039.20188
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00003
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000010.005000.00005
Tin solderTin (Sn)7440-31-50.1599899.990000.93887
subTotal0.16000100.000000.93897
Solder PasteLead alloyLead (Pb)7439-92-10.8972592.500005.26555
Silver alloySilver (Ag)7440-22-40.024252.500000.14231
Tin alloyTin (Sn)7440-31-50.048505.000000.28462
subTotal0.97000100.000005.69248
total17.04000100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.