×

Chemical content PMEG100V060ELPD

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG100V060ELPDSOT1289CFP1572.64500 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934069522146512601235Seremban, Malaysia; D-22529 HAMBURG, GermanyLeaded
934069522139612601235Seremban, Malaysia; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.03500100.000001.42474
subTotal1.03500100.000001.42474
ClipCopper alloyCopper (Cu)7440-50-87.3482299.8400010.11525
Iron (Fe)7439-89-60.011040.150000.01520
MetallisationCopper (Cu)7440-50-80.000740.010000.00101
subTotal7.36000100.0000010.13146
Lead FrameCopper alloyCopper (Cu)7440-50-833.8529998.2100046.60057
Iron (Fe)7439-89-60.003450.010000.00474
Phosphorus (P)7723-14-00.013790.040000.01898
Pure metal layerCopper (Cu)7440-50-80.027580.080000.03796
Silver (Ag)7440-22-40.572201.660000.78767
subTotal34.47000100.0000047.44992
Mould CompoundFillerSilica fused60676-86-014.6686071.0000020.19217
PigmentCarbon black1333-86-40.061980.300000.08532
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-24.0700219.700005.60262
Phenolic resinProprietary1.859409.000002.55957
subTotal20.66000100.0000028.43968
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00000
Bismuth (Bi)7440-69-90.000000.001000.00000
Copper (Cu)7440-50-80.000000.001000.00000
Lead (Pb)7439-92-10.000000.005000.00001
Tin solderTin (Sn)7440-31-50.0899999.990000.12388
subTotal0.09000100.000000.12389
Solder PasteLead alloyLead (Pb)7439-92-18.6236595.5000011.87095
Silver alloySilver (Ag)7440-22-40.225752.500000.31076
Tin alloyTin (Sn)7440-31-50.180602.000000.24861
subTotal9.03000100.0000012.43032
total72.64500100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.