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Chemical content PMEG100V100ELPD

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Type numberPackagePackage descriptionTotal product weight
PMEG100V100ELPDSOT1289CFP1573.41800 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934069519146512601235D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
934069519139512601235D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.80800100.000002.46261
subTotal1.80800100.000002.46261
ClipCopper alloyCopper (Cu)7440-50-87.3460299.8100010.00574
Iron (Fe)7439-89-60.011040.150000.01504
Phosphorus (P)7723-14-00.002940.040000.00401
subTotal7.36000100.0000010.02479
Lead FrameCopper alloyCopper (Cu)7440-50-833.8529998.2100046.10993
Iron (Fe)7439-89-60.003450.010000.00470
Phosphorus (P)7723-14-00.013790.040000.01878
Pure metal layerCopper (Cu)7440-50-80.027580.080000.03756
Silver (Ag)7440-22-40.572201.660000.77938
subTotal34.47000100.0000046.95035
Mould CompoundFillerSilica fused60676-86-014.6686071.0000019.97957
PigmentCarbon black1333-86-40.061980.300000.08442
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-24.0700219.700005.54363
Phenolic resinProprietary1.859409.000002.53262
subTotal20.66000100.0000028.14024
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00000
Bismuth (Bi)7440-69-90.000000.001000.00000
Copper (Cu)7440-50-80.000000.001000.00000
Lead (Pb)7439-92-10.000000.005000.00001
Tin solderTin (Sn)7440-31-50.0899999.990000.12257
subTotal0.09000100.000000.12258
Solder PasteLead alloyLead (Pb)7439-92-18.6236595.5000011.74596
Silver alloySilver (Ag)7440-22-40.225752.500000.30749
Tin alloyTin (Sn)7440-31-50.180602.000000.24599
subTotal9.03000100.0000012.29944
total73.41800100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.