Chemical content PMEG100V100ELPE-Q

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Type numberPackagePackage descriptionTotal product weight
PMEG100V100ELPE-QSOT1289BCFP1578.64400 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934664820139312601235Seremban, Malaysia; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-37.03400100.000008.94410
ClipCopper alloyCopper (Cu)7440-50-87.3460299.810009.34085
Iron (Fe)7439-89-60.011040.150000.01404
Phosphorus (P)7723-14-00.002940.040000.00374
Lead FrameCopper alloyCopper (Cu)7440-50-834.4217499.8600043.76906
Iron (Fe)7439-89-60.034470.100000.04383
Phosphorus (P)7723-14-00.013790.040000.01753
Mould CompoundFillerSilica -amorphous-7631-86-92.0660010.000002.62703
Silica fused60676-86-015.4950075.0000019.70271
PigmentCarbon black1333-86-40.061980.300000.07881
PolymerEpoxy resin systemProprietary1.590827.700002.02281
Phenolic resinProprietary1.446207.000001.83892
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00000
Bismuth (Bi)7440-69-90.000000.001000.00000
Copper (Cu)7440-50-80.000000.001000.00000
Lead (Pb)7439-92-10.000000.005000.00001
Tin solderTin (Sn)7440-31-50.0899999.990000.11443
Solder PasteLead alloyLead (Pb)7439-92-18.6236595.5000010.96543
Silver alloySilver (Ag)7440-22-40.225752.500000.28705
Tin alloyTin (Sn)7440-31-50.180602.000000.22964
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.