Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMEG2005CT-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG2005CT-QSOT23TO-236AB8.160000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346649132151126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.340000100.0000004.166667
subTotal0.340000100.0000004.166667
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0024630.0900000.030187
Carbon (C)7440-44-00.0010950.0400000.013417
Chromium (Cr)7440-47-30.0060210.2200000.073792
Cobalt (Co)7440-48-40.0117690.4300000.144229
Iron (Fe)7439-89-61.31321347.98000016.093292
Manganese (Mn)7439-96-50.0235380.8600000.288458
Nickel (Ni)7440-02-00.98915236.14000012.121958
Phosphorus (P)7723-14-00.0005470.0200000.006708
Silicon (Si)7440-21-30.0071160.2600000.087208
Sulphur (S)7704-34-90.0005470.0200000.006708
Pure metal layerCopper (Cu)7440-50-80.31119711.3700003.813687
Silver (Ag)7440-22-40.0703412.5700000.862021
subTotal2.737000100.00000033.541667
Mould CompoundAdditiveNon hazardousProprietary0.1410852.9000001.728983
Triphenylphosphine603-35-00.0024320.0500000.029810
FillerSilica -amorphous-7631-86-93.50280072.00000042.926471
PigmentCarbon black1333-86-40.0024320.0500000.029810
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.72975015.0000008.943015
Phenol Formaldehyde resin (generic)9003-35-40.48650010.0000005.962010
subTotal4.865000100.00000059.620098
Post-PlatingImpurityLead (Pb)7439-92-10.0000090.0045000.000105
Non hazardousProprietary0.0001050.0555000.001292
Tin solderTin (Sn)7440-31-50.18988699.9400002.327034
subTotal0.190000100.0000002.328431
WireImpurityNon hazardousProprietary0.0000030.0100000.000034
Pure metalCopper (Cu)7440-50-80.02799799.9900000.343103
subTotal0.028000100.0000000.343137
total8.160000100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.