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Chemical content PMEG2010AEJ

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Type numberPackagePackage descriptionTotal product weight
PMEG2010AEJSOD323FSOD323F3.81610 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340590061151512601235Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.07000100.000001.83433
subTotal0.07000100.000001.83433
Lead FrameCopper alloyCopper (Cu)7440-50-81.4745297.6500038.63932
Iron (Fe)7439-89-60.031862.110000.83491
Phosphorus (P)7723-14-00.000450.030000.01187
Zinc (Zn)7440-66-60.001960.130000.05144
Pure metal layerSilver (Ag)7440-22-40.001210.080000.03166
subTotal1.51000100.0000039.56920
Mould CompoundFillerSilica fused60676-86-01.6071475.1000042.11472
PigmentCarbon black1333-86-40.006420.300000.16823
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.3745017.500009.81368
Phenol Formaldehyde resin (generic)9003-35-40.151947.100003.98155
subTotal2.14000100.0000056.07818
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00009
Non hazardousProprietary0.000040.055500.00116
Tin solderTin (Sn)7440-31-50.0799599.940002.09512
subTotal0.08000100.000002.09637
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalCopper (Cu)7440-50-80.0161099.990000.42185
subTotal0.01610100.000000.42189
total3.81610100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.