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Chemical content PMEG2010EJ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG2010EJSOD323FSOD323F3.86400 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340585241151612601235Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.12000100.000003.10559
subTotal0.12000100.000003.10559
Lead FrameCopper alloyCopper (Cu)7440-50-81.4745297.6500038.16033
Iron (Fe)7439-89-60.031862.110000.82456
Phosphorus (P)7723-14-00.000450.030000.01172
Zinc (Zn)7440-66-60.001960.130000.05080
Pure metal layerSilver (Ag)7440-22-40.001210.080000.03126
subTotal1.51000100.0000039.07867
Mould CompoundFillerSilica fused60676-86-01.6071475.1000041.59265
PigmentCarbon black1333-86-40.006420.300000.16615
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.3745017.500009.69203
Phenol Formaldehyde resin (generic)9003-35-40.151947.100003.93219
subTotal2.14000100.0000055.38302
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00009
Non hazardousProprietary0.000040.055500.00115
Tin solderTin (Sn)7440-31-50.0799599.940002.06915
subTotal0.08000100.000002.07039
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalCopper (Cu)7440-50-80.0140099.990000.36228
subTotal0.01400100.000000.36232
total3.86400100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.