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Chemical content PMEG3002AEL

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG3002AELSOD882DFN1006-20.91480 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340580113151512601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.83078
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11445
Phenolic resinProprietary0.0013513.530000.14790
subTotal0.01000100.000001.09313
DieDoped siliconSilicon (Si)7440-21-30.02000100.000002.18627
subTotal0.02000100.000002.18627
Lead FrameCopper alloyCopper (Cu)7440-50-80.3874194.4900042.34904
Magnesium (Mg)7439-95-40.000820.200000.08964
Nickel (Ni)7440-02-00.012923.150001.41178
Silicon (Si)7440-21-30.002830.690000.30925
Pure metal layerGold (Au)7440-57-50.000120.030000.01345
Nickel (Ni)7440-02-00.005211.270000.56920
Palladium (Pd)7440-05-30.000700.170000.07619
subTotal0.41000100.0000044.81855
Mould CompoundFillerSilica -amorphous-7631-86-90.1035023.0000011.31395
Silica fused60676-86-00.2700060.0000029.51465
Flame retardantMetal hydroxideProprietary0.013503.000001.47573
ImpurityBismuth (Bi)7440-69-90.002250.500000.24596
PigmentCarbon black1333-86-40.002250.500000.24596
PolymerEpoxy resin systemProprietary0.031507.000003.44338
Phenolic resinProprietary0.027006.000002.95146
subTotal0.45000100.0000049.19109
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00121
Tin solderTin (Sn)7440-31-50.0199999.940002.18496
subTotal0.02000100.000002.18627
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0048099.990000.52465
subTotal0.00480100.000000.52470
total0.91480100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.