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Chemical content PMEG3002AELD

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG3002AELDSOD882DDFN1006-20.66060 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065337315512601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.34514
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04755
Phenolic resinProprietary0.0004113.530000.06144
subTotal0.00300100.000000.45413
DieDoped siliconSilicon (Si)7440-21-30.02000100.000003.02755
subTotal0.02000100.000003.02755
Lead FrameCopper alloyChromium (Cr)7440-47-30.000800.257500.12162
Copper (Cu)7440-50-80.2957694.7950044.77148
Tin (Sn)7440-31-50.000750.238800.11278
Zinc (Zn)7440-66-60.000600.190800.09011
Pure metal layerGold (Au)7440-57-50.000170.055000.02598
Nickel (Ni)7440-02-00.013394.292002.02710
Palladium (Pd)7440-05-30.000530.170900.08072
subTotal0.31200100.0000047.22979
Mould CompoundFillerSilica -amorphous-7631-86-90.0687723.0000010.41023
Silica fused60676-86-00.1794060.0000027.15713
Flame retardantMetal hydroxideProprietary0.008973.000001.35786
ImpurityBismuth (Bi)7440-69-90.001500.500000.22631
PigmentCarbon black1333-86-40.001500.500000.22631
PolymerEpoxy resin systemProprietary0.020937.000003.16833
Phenolic resinProprietary0.017946.000002.71571
subTotal0.29900100.0000045.26188
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00015
Non hazardousProprietary0.000010.055500.00185
Tin solderTin (Sn)7440-31-50.0219999.940003.32831
subTotal0.02200100.000003.33031
WireImpurityNon hazardousProprietary0.000000.010000.00007
Pure metalGold (Au)7440-57-50.0046499.990000.70232
subTotal0.00464100.000000.70239
total0.66060100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.