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Chemical content PMEG3005EL

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG3005ELSOD882DFN1006-20.91472 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340601153151412601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.83086
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11446
Phenolic resinProprietary0.0013513.530000.14791
subTotal0.01000100.000001.09323
DieDoped siliconSilicon (Si)7440-21-30.02000100.000002.18646
subTotal0.02000100.000002.18646
Lead FrameCopper alloyCopper (Cu)7440-50-80.3874194.4900042.35274
Magnesium (Mg)7439-95-40.000820.200000.08964
Nickel (Ni)7440-02-00.012923.150001.41191
Silicon (Si)7440-21-30.002830.690000.30927
Pure metal layerGold (Au)7440-57-50.000120.030000.01345
Nickel (Ni)7440-02-00.005211.270000.56925
Palladium (Pd)7440-05-30.000700.170000.07620
subTotal0.41000100.0000044.82246
Mould CompoundFillerSilica -amorphous-7631-86-90.1035023.0000011.31494
Silica fused60676-86-00.2700060.0000029.51723
Flame retardantMetal hydroxideProprietary0.013503.000001.47586
ImpurityBismuth (Bi)7440-69-90.002250.500000.24598
PigmentCarbon black1333-86-40.002250.500000.24598
PolymerEpoxy resin systemProprietary0.031507.000003.44368
Phenolic resinProprietary0.027006.000002.95172
subTotal0.45000100.0000049.19539
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00121
Tin solderTin (Sn)7440-31-50.0199999.940002.18515
subTotal0.02000100.000002.18646
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0047299.990000.51595
subTotal0.00472100.000000.51600
total0.91472100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.