Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMEG3005ELS

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG3005ELSSOD882BDDFN1006-20.881720 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346639843153126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.01444076.0000001.637708
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00198910.4700000.225616
Phenolic resinProprietary0.00257113.5300000.291555
subTotal0.019000100.0000002.154879
DieDoped siliconSilicon (Si)7440-21-30.020000100.0000002.268294
subTotal0.020000100.0000002.268294
Lead FrameCopper alloyCopper (Cu)7440-50-80.37762095.60000042.827655
Magnesium (Mg)7439-95-40.0005920.1500000.067198
Nickel (Ni)7440-02-00.0117712.9800001.335004
Silicon (Si)7440-21-30.0025680.6500000.291192
Pure metal layerGold (Au)7440-57-50.0000400.0100000.004480
Nickel (Ni)7440-02-00.0022520.5700000.255353
Palladium (Pd)7440-05-30.0001580.0400000.017920
subTotal0.395000100.00000044.798802
Mould CompoundFillerSilica -amorphous-7631-86-90.0337557.9800003.828358
Silica fused60676-86-00.33878980.09200038.423667
PigmentCarbon black1333-86-40.0039250.9280000.445203
PolymerEpoxy resin systemProprietary0.0357448.4500004.053838
Phenolic resinProprietary0.0107862.5500001.223348
subTotal0.423000100.00000047.974414
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000102
Non hazardousProprietary0.0000110.0555000.001259
Tin solderTin (Sn)7440-31-50.01998899.9400002.266933
subTotal0.020000100.0000002.268294
WireImpurityNon hazardousProprietary0.0000000.0100000.000054
Pure metalGold (Au)7440-57-50.00472099.9900000.535264
subTotal0.004720100.0000000.535317
total0.881720100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.