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Chemical content PMEG3010ER-Q

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Type numberPackagePackage descriptionTotal product weight
PMEG3010ER-QSOD123WSOD216.78000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934664423115112601235Dongguan, China; D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.43000100.000002.56257
subTotal0.43000100.000002.56257
ClipCopper alloyCopper (Cu)7440-50-83.6852099.8700021.96188
Iron (Fe)7439-89-60.003690.100000.02199
Phosphorus (P)7723-14-00.001110.030000.00660
subTotal3.69000100.0000021.99047
Lead FrameCopper alloyCopper (Cu)7440-50-85.4156798.1100032.27456
Iron (Fe)7439-89-60.005520.100000.03290
Phosphorus (P)7723-14-00.001660.030000.00987
Pure metal layerSilver (Ag)7440-22-40.097151.760000.57897
subTotal5.52000100.0000032.89630
Mould CompoundFillerSilica fused60676-86-04.4588071.0000026.57211
PigmentCarbon black1333-86-40.018840.300000.11228
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2371619.700007.37282
Phenolic resinProprietary0.565209.000003.36830
subTotal6.28000100.0000037.42551
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00003
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000010.005000.00004
Tin solderTin (Sn)7440-31-50.1399999.990000.83424
subTotal0.14000100.000000.83433
Solder PasteLead alloyLead (Pb)7439-92-10.6660092.500003.96901
Silver alloySilver (Ag)7440-22-40.018002.500000.10727
Tin alloyTin (Sn)7440-31-50.036005.000000.21454
subTotal0.72000100.000004.29082
total16.78000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.