Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMEG3020CPA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG3020CPASOT1061HUSON37.935050 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340643471156126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.08800080.0000001.109004
PolymerAcrylic resinProprietary0.02200020.0000000.277251
subTotal0.110000100.0000001.386255
DieDoped siliconSilicon (Si)7440-21-30.590000100.0000007.435366
subTotal0.590000100.0000007.435366
Lead FrameCopper alloyCopper (Cu)7440-50-82.58001492.94000032.514154
Magnesium (Mg)7439-95-40.0047190.1700000.059473
Nickel (Ni)7440-02-00.0860563.1000001.084505
Silicon (Si)7440-21-30.0194320.7000000.244888
Pure metal layerGold (Au)7440-57-50.0011100.0400000.013994
Nickel (Ni)7440-02-00.0774502.7900000.976054
Palladium (Pd)7440-05-30.0072180.2600000.090958
subTotal2.776000100.00000034.984027
Mould CompoundAdditiveNon hazardousProprietary0.0174660.4100000.220112
FillerSilica -amorphous-7631-86-90.0123540.2900000.155689
Silica fused60676-86-03.66999086.15000046.250370
HardenerPhenolic resinProprietary0.1827544.2900002.303123
PigmentCarbon black1333-86-40.0080940.1900000.102003
PolymerEpoxy resin systemProprietary0.3693428.6700004.654564
subTotal4.260000100.00000053.685862
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000096
Non hazardousProprietary0.0000940.0555000.001189
Tin solderTin (Sn)7440-31-50.16989899.9400002.141108
subTotal0.170000100.0000002.142394
WireImpurityNon hazardousProprietary0.0000030.0100000.000037
Pure metalCopper (Cu)7440-50-80.02904799.9900000.366061
subTotal0.029050100.0000000.366097
total7.935050100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.